X-ray matrix imager with shared data lines and multi-gate driving

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Solution Overview

Problem

Conventional high-resolution X-ray matrix imagers face challenges in achieving small pixel pitches due to high connection densities, limiting resolution, especially on glass substrates, and require complex external circuits for signal driving and detection.

Innovation Solution

A matrix imager design featuring a shared data line structure with multiple-gate-line selection and row/column multiplexing schemes, reducing the number of data lines and charge amplifier channels while increasing gate lines and drivers, allowing for larger pitch widths without significant cost or complexity increases, and incorporating high-impedance resistor circuits to prevent unintended pixel switching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple patched silicon wafers are used to form a large-sized imager, then the imager size can be increased, but the manufacturing complexity and alignment precision requirements increase

Engineering Contradiction:
Improveimager sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The imager is divided into multiple patches, each formed on a separate silicon wafer. These patches are then assembled to create the large-sized imager, allowing manageable fabrication of individual patches while achieving the desired overall size through concatenation of multiple smaller units

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple patched wafers are combined or concatenated to form the complete large-sized imager. This merging approach allows the system to achieve large area coverage by integrating several smaller, independently fabricated patches into a unified imaging device

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If external circuits are used to drive and detect signals from the matrix of pixels, then the imager can function with a single large glass substrate, but the device complexity and connection density increase

Engineering Contradiction:
Improvesubstrate integrationVSAvoidconnection density
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent transitions from a planar two-dimensional pixel arrangement to a three-dimensional stacked architecture. Multiple pixel layers are vertically stacked with interleaved readout circuits, utilizing the vertical dimension to reduce lateral connection density while maintaining full functionality

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Measurement precision

If small pixel pitches are used to achieve high resolution, then the imaging resolution improves, but the number of connections to external driving circuits increases

Engineering Contradiction:
Improveimaging resolutionVSAvoidnumber of connections
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

By stacking multiple pixel layers vertically, the patent reduces the number of lateral connections required. Each layer can share common readout circuitry and data lines with adjacent layers, significantly reducing the total connection count while maintaining high horizontal resolution through small pixel pitches

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The readout circuits and data lines are designed to serve multiple pixel layers simultaneously. A single data line can carry signals from multiple layers, and readout circuits process data from several layers, reducing the overall number of connections while maintaining high-resolution capability across all layers

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances resolution capabilities by reducing the complexity and cost of the read-out circuit, enabling larger pitch widths and improved manufacturing efficiency while maintaining high-resolution imaging performance.

Implementation Method 1

a plurality of rows of pixels configured to accumulate charges in response to light or radiation

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentEP2826068B1X-ray matrix imager
Publication Date: 2020.03.04 VAREX IMAGING CORP
  • EP2826068B1 patent drawingFigure 1
  • EP2826068B1 patent drawingFigure 2
  • EP2826068B1 patent drawingFigure 3

AI summary

An X-Ray matrix imager includes a matrix, a plurality of gate line sets, and a plurality of data lines. The matrix includes a plurality of rows of pixels configured to accumulate charges in response to light or radiation. Each of the gate line sets includes a first gate line coupled to a first pixel among a first row of pixels of the matrix, and a second gate line coupled to a second pixel among the first row of pixels of the matrix, wherein the first pixel is adjacent to the second pixel. Each of the data lines is arranged to be coupled to the plurality of gate line sets for receiving charges accumulated on the first row of pixels. The X-Ray matrix imager is configured to operate based on multiple-gate-line driving scheme and shared-data-line driving scheme.