X-ray Imaging Panel Terminal Structure for Etching Protection
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Solution Overview
Problem
Existing X-ray imaging panels face challenges in efficiently producing terminals during the active area formation process, leading to potential disappearance of conductive films used for terminals due to etching steps, which affects production efficiency and increases the risk of connection defects.
Innovation Solution
The X-ray imaging panel design includes a substrate with both an active area and a terminal area, where the terminal area features a specific configuration of conductive layers and insulating films that prevent the disappearance of conductive films during etching, ensuring simultaneous formation of terminals and reducing connection defects by using overlapping layers made of the same material as the gate electrode, source electrode, and bias line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conductive films used in pad portions of terminals are made of the same materials as those used for forming the bias lines and electrodes in the active area, then the production process can be simplified and production efficiency can be improved, but the conductive films that are to become the pad portions of the terminals would disappear in the etching step used to form the bias lines and electrodes
Solution Approach 1:
The terminal area is divided into distinct layers: a first conductive layer for the pad portion, a terminal first insulating film, and a second conductive layer for the bias line. This segmentation allows each layer to have different material properties optimized for its specific function, preventing the pad portion from being etched away while maintaining production efficiency.
Solution Approach 2:
The pad portion (first conductive layer) is made of a material different from the bias line material, giving it local quality that makes it resistant to etching. This localized material differentiation ensures that the terminal pad maintains its integrity while the bias line is properly formed through etching.
2Productivity
If terminals are formed simultaneously with the active area, then production efficiency is improved, but the conductive films for terminals are likely to disappear during etching steps
Solution Approach 1:
The first conductive layer (pad portion) is formed in advance as a base layer before the etching steps for the bias lines. This preliminary formation ensures that the terminal pad structure is already in place and protected, allowing simultaneous formation of terminals and active area without compromising terminal integrity.
Solution Approach 2:
The terminal first insulating film acts as an intermediary layer between the first conductive layer (pad) and the second conductive layer (bias line). This intermediate insulating film protects the pad portion during etching while allowing the bias line to be properly formed, enabling simultaneous formation with high precision.
3Device complexity
If the same material is used for terminal conductive films and active area conductive films, then the number of production steps is reduced, but connection defects increase due to film disappearance
Solution Approach 1:
The conductive films are segmented into different layers with different materials: the first conductive layer (pad) uses a material resistant to etching, while the second conductive layer (bias line) uses material suitable for etching. This segmentation maintains production simplicity while ensuring connection reliability.
Solution Approach 2:
The terminal structure uses composite material arrangement where the first conductive layer and second conductive layer are made of different materials optimized for their respective functions. This composite approach reduces connection defects while maintaining a relatively simple production process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances production efficiency by ensuring the formation of terminals during the active area production, minimizing connection defects and maintaining the integrity of conductive layers, thereby improving the overall manufacturing process of the imaging panel.
Implementation Method 1
a photoelectric conversion layer that is provided on the lower electrode and converts the scintillation light into charges
Data Source
AI summary
Provided is an X-ray imaging panel and a method for producing the same with improved productivity. An imaging panel 1 has an active area and a terminal area on a substrate 101. In the terminal area, there are provided: a first conductive layer 100; a terminal first insulating film 103 that is formed with the same material as that of a first insulating film in the active area, and has a first opening; a second conductive layer 1701 that is formed with the same material as that of a conductive film in the active area, and overlaps with the first conductive layer 100 at a position where the first opening is provided; and a cover layer provided at the position where the first opening is provided, so as to be arranged between the first conductive layer 100 and the second conductive layer 1701. The first conductive layer 100 is formed with the same material as that of any one of a gate electrode and a source electrode of a thin film transistor as well as a lower electrode in the active area. The cover layer is formed with the same material as that of at least one element arranged in an upper layer with respect to one element made of the same material as that of the first conductive layer 100 among the source electrode, the lower electrode, and a bias line in the active area.