Sensing Substrate Structure for Static-Free X-Ray Image Uniformity

A conductive pattern layer is introduced as an intermediary between the transparent conductive electrode and the sensing element. This intermediate layer provides electrostatic shielding to prevent static electricity residues and inconsistent electric fields from affecting the sensing element, while the transparent conductive electrode maintains high light transmittance. The conductive pattern acts as a mediator that resolves the conflict between optical performance and imaging uniformity.

The conductive pattern is designed to create an equipotential region over the sensing element by distributing charge uniformly across its surface. This equipotential shielding effect prevents local electric field variations and static electricity accumulation, ensuring uniform imaging across the detector while allowing the transparent conductive electrode to maintain optimal light transmittance properties.

The conductive pattern is designed with spatially varying properties: it provides continuous electrostatic shielding coverage over the sensing element area while being transparent or semi-transparent in regions where light transmission is critical. This local differentiation of conductive material properties allows simultaneous achievement of image uniformity and high light transmittance.

The conductive pattern is constructed using composite material structures that combine conductive and transparent properties. This could involve transparent conductive oxides, metal nanoparticle networks, or multi-layer composite structures that provide sufficient electrostatic shielding while maintaining high optical transmittance, thus resolving the contradiction between shielding effectiveness and light transmission.

The conductive pattern is positioned in a different spatial dimension relative to the sensing element and scintillator bonding interface. By placing the conductive pattern on the opposite side of the sensing element from the scintillator, or in a lateral position rather than directly between bonding surfaces, the design achieves effective electrostatic shielding without interfering with the bonding quality between the scintillator and sensing element.

The device structure is segmented into distinct functional layers with the conductive pattern positioned in a specific layer that separates it from the scintillator bonding interface. This segmentation allows the conductive pattern to perform its shielding function independently without compromising the bonding quality of adjacent layers, maintaining both shielding effectiveness and manufacturing precision.