X-ray Sensing Device Thickness Measurement via Distance Sensors
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Solution Overview
Problem
General X-ray image sensing operations face poor shooting effects due to insufficient information about the shooting object, as setting parameters for X-ray sensing panels and X-ray source devices are typically set manually without precise object thickness measurements.
Innovation Solution
A sensing device with a microcontroller unit and distance sensor is installed on the X-ray source device to measure the distance between the X-ray sensing panel and the object, allowing for the calculation of the object's thickness parameter, which can be used to adjust the X-ray source device settings for optimal imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual setting parameters are used for X-ray sensing panel and X-ray source device, then operator flexibility is maintained, but shooting effect deteriorates due to insufficient information about the shooting object
Solution Approach 1:
The sensing device is installed on the X-ray source device, with the distance sensor integrated into the existing device structure. This nesting approach allows the sensing function to be added without requiring a completely separate measurement system, thereby improving measurement precision while minimizing the increase in overall device complexity
Solution Approach 2:
The sensing device serves multiple functions: it measures the distance between the X-ray source device and the shooting object, calculates thickness parameters, and provides data for automatic parameter setting. This multi-functionality allows a single added device to address multiple needs, improving measurement capabilities without proportionally increasing complexity
2Productivity
If automatic parameter setting is implemented based on object thickness, then shooting effect improves, but device complexity increases due to additional sensing components
Solution Approach 1:
The distance sensor measures the distance before the X-ray sensing operation begins, and the microcontroller unit calculates the thickness parameter in advance. This preliminary measurement and calculation enable automatic parameter setting to be prepared beforehand, improving sensing operation efficiency by eliminating manual measurement steps during the actual shooting process
Solution Approach 2:
The microcontroller unit automatically calculates the thickness parameter based on distance measurements from the distance sensor, and the system uses this calculated data to automatically set sensing parameters. This self-service capability reduces the need for manual intervention and improves productivity, while the automation is achieved through integrated processing within the added sensing device
3Measurement precision
If distance sensor is installed on X-ray source device, then object thickness can be measured accurately, but device complexity increases
Solution Approach 1:
The distance sensor is installed on the X-ray source device, utilizing the existing structural framework and mounting mechanisms. This nesting approach allows accurate distance measurement to be achieved by integrating the sensor into the available space and structural elements, thereby minimizing the increase in device complexity while maintaining measurement precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate determination of the object's thickness parameter, improving the X-ray image shooting effect by allowing for adaptive adjustment of X-ray source device settings based on the object's dimensions.
Implementation Method 1
obtaining a first distance parameter between an X-ray sensing panel and a distance sensor by the distance sensor of the sensing device; obtaining a second distance parameter between a shooting object and the distance sensor by the distance sensor
Data Source
AI summary
A sensing method and a sensing device are provided. The sensing method includes the following steps: installing the sensing device on a X-ray source device; obtaining a first distance parameter between a X-ray sensing panel and a distance sensor by the distance sensor of the sensing device; obtaining a second distance parameter between a shooting subject and the distance sensor by the distance sensor of the sensing device; and calculating a thickness parameter of the shooting object according to the first distance parameter and the second distance parameter by a microcontroller unit of the sensing device.