X-ray Sensor Head Maximizing Detection Area via Nested Bonding Wires
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing X-ray detector sensor heads have limitations in maximizing detection area while maintaining overall size, leading to reduced radiation detection efficiency and increased distance from the sample in applications like electron beam microanalysis and X-ray fluorescence analysis.
Innovation Solution
The design incorporates a sensor head with a first conductor carrier and a sensor element, where the detection area is maximized by concealing bonding wires and contact pins within the detection area, allowing for increased radiation detection and closer proximity to the sample, using a combination of conductive materials and thermoelectric cooling, and arranging multiple sensor heads in a honeycomb pattern for enhanced radiation detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the detection area of the sensor head is increased, then the radiation detection efficiency is improved, but the overall size of the sensor head increases
Solution Approach 1:
The patent applies nesting by placing bonding wires and contact pins underneath the detection area, effectively hiding them within the spatial envelope of the sensor head. This allows the detection area to be maximized at the front face while the supporting electrical components are nested in the underlying structure, preventing increase in overall footprint.
Solution Approach 2:
The patent transitions components from the two-dimensional plane of the detection area to the third dimension by positioning bonding wires and contact pins in the vertical space underneath the detection area. This dimensional relocation allows the detection area to occupy the full front face area while electrical connections are routed through the depth of the sensor head structure.
2Productivity
If the sensor head is positioned closer to the sample, then the solid angle of radiation detection is increased, but the space required for electrical connections is reduced
Solution Approach 1:
The patent nests electrical connection components (bonding wires and contact pins) underneath the detection area, allowing the sensor head to be positioned closer to the sample without requiring additional lateral space for electrical connections. The nested arrangement accommodates connection space within the vertical profile rather than requiring lateral clearance.
Solution Approach 2:
The patent relocates electrical connection components from lateral space to vertical space underneath the detection area. This dimensional reorganization enables the sensor head to achieve minimal distance to the sample while electrical connections are routed through the depth dimension, resolving the spatial conflict between proximity requirement and connection space requirement.
3Ease of manufacture
If bonding wires and contact pins are arranged outside the detection area, then electrical connections are simplified, but the detection area is reduced
Solution Approach 1:
The patent nests bonding wires and contact pins underneath the detection area rather than arranging them outside. This nested configuration maintains the full detection area at the front face while electrical connections are routed through the underlying structure, achieving both maximum detection area and manageable electrical connection complexity within the nested space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases the detected radiation quantity and allows for closer positioning of the sensor head to the sample, enhancing detection efficiency and array utilization in X-ray detectors.
Implementation Method 1
The sensor element can be, for example, an Si(Li) detector, an HPGe detector, a PIN diode, a detector consisting of compound semiconductors
Implementation Method 2
use a combination of conductive materials and thermoelectric cooling
Data Source
AI summary
A sensor head for an X-ray detector is specified. The sensor head includes a first conductor carrier having a frontal face, and a sensor element sensitive to X-ray radiation. The sensor element is arranged on the frontal face of the first conductor carrier, is electrically conductively connected to conductors of the first conductor carrier and has a detection area. Furthermore, the sensor head includes contact elements electrically conductively connected to the sensor element via the first conductor carrier and bonding wires that electrically conductively connect the first conductor carrier to the contact elements. The sensor element is electrically conductively connected to the contact elements. In a plan view of the detection area, the detection area at least partly covers the bonding wires.