X-ray Sensor Shielding Signal Processing Electronics
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Solution Overview
Problem
Existing X-ray computed tomography machines face challenges in protecting signal processing electronics from harmful X-rays, leading to signal corruption and increased complexity due to the need for longer signal routing distances, which adds mass and height to the assembly.
Innovation Solution
The X-ray sensing and signal processing apparatus incorporates an X-ray sensor assembly supported on a printed circuit board with integrated circuit dies, utilizing micro-vias and through-hole vias to route signals efficiently while aligning the sensor assembly to shield signal processing electronics from X-rays, and using gap projection areas for misalignment detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If signal processing electronics are placed closer to the X-ray sensor assembly, then signal routing distance is reduced and assembly mass is decreased, but the electronics are exposed to harmful X-rays causing signal corruption
Solution Approach 1:
The patent utilizes the harmful X-rays by positioning the scintillator array to absorb and convert them into visible light photons, which then illuminate the photodetector array. The scintillator material transforms the harmful ionizing radiation into useful optical signals that can be processed by the electronics without damage.
Solution Approach 2:
The scintillator array serves as an intermediary between the X-rays and the photodetector electronics. It absorbs the harmful X-rays and converts them into visible light, which the photodetectors can detect without being damaged by direct X-ray exposure. This mediator protects the electronics while enabling signal generation.
2Object-affected harmful factors
If traditional separate mounting of sensor assembly and electronics is used, then electronics are protected from X-rays, but assembly height and complexity increase
Solution Approach 1:
The patent merges the sensor assembly and signal processing electronics into a single integrated unit mounted on the same PCB. The scintillator array, photodetector array, and electronics are all positioned on the same substrate, eliminating the need for separate mounting structures and reducing overall assembly height while maintaining X-ray protection through the scintillator's light-conversion function.
Solution Approach 2:
The patent transitions from a vertical stacking arrangement (separate mounting that increases height) to a planar integration on the PCB surface. By arranging components in two dimensions on the PCB rather than stacking them vertically, the assembly achieves compact form factor without compromising electronics protection.
3Ease of manufacture
If integrated circuit dies are placed directly on the PCB surface, then manufacturing is simplified, but X-ray alignment precision and electronics protection become difficult
Solution Approach 1:
The integrated circuit dies are nested within recesses or cavities in the PCB surface, positioned beneath the scintillator array. This nesting arrangement allows the electronics to be mounted using standard PCB techniques while the overlying scintillator material provides X-ray shielding and optical coupling, achieving both manufacturing ease and alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents signal corruption, reduces assembly height and mass, and ensures reliable signal processing by keeping sensitive electronics shielded from X-rays, while allowing for precise alignment and quality control.
Implementation Method 1
a scintillator array (120) having a plurality of scintillator pixels (122) separated by scintillator pixel gaps (124)
Data Source
AI summary
An apparatus having an X-ray sensor assembly with X-ray blocking pixels divided by X-ray transmitting gaps with the X-ray blocking pixels casting an X-ray blocking shadow; and a die containing signal processing electronics, with the signal processing electronics positioned substantially entirely within the X-ray blocking shadow. A method for detecting the alignment between the X-ray sensor assembly and the die is disclosed. Also disclosed is an X-ray computed tomography machine having a printed circuit board (“PCB”), a die embedded in the PCB, and a signal source wherein signals are routed to and from the die by traces on at least one of the surfaces of the PCB.