Non-destructive 3D Specimen Characterization via X-ray Simulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current techniques for profiling specimens with three-dimensional internal structures are destructive, making it challenging to implement non-destructive methods suitable for high-volume manufacturing (HVM) in the semiconductor industry.
Innovation Solution
A system utilizing X-ray measurements and computer simulation for non-destructive three-dimensional probing and characterization of specimens. This system includes an electron beam source, an X-ray detector, and processing circuitry that extracts key features from X-ray measurement data and determines structural parameters through simulation and optimization algorithms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If destructive techniques (extraction of lamellas, shaving off slices) are used for profiling specimens, then measurement precision of three-dimensional internal structures is improved, but the specimen is damaged and cannot be used for high-volume manufacturing
Solution Approach 1:
The patent replaces mechanical destructive methods (extraction, slicing) with non-mechanical X-ray based characterization methods. The system uses X-ray measurements combined with computer simulation to obtain three-dimensional structural information without physically altering the specimen, thereby eliminating specimen damage while maintaining measurement capability.
Solution Approach 2:
The patent introduces computer simulation as an intermediary between X-ray measurements and structural characterization. The simulation models the interaction between X-rays and the specimen, allowing indirect observation of internal structures through measured X-ray signals without direct physical contact or destruction of the specimen.
2Productivity
If non-destructive techniques are developed for specimen profiling, then specimen integrity is preserved for high-volume manufacturing, but measurement precision and accuracy of three-dimensional structures deteriorates
Solution Approach 1:
The patent employs multiple X-ray measurement parameters including different X-ray energies, incident angles, and detection geometries to characterize the specimen. By varying these parameters and combining measurements with computer simulation, the system achieves accurate three-dimensional structural information while maintaining specimen integrity for continued manufacturing use.
3Measurement precision
If traditional destructive sampling is used, then accurate structural data is obtained, but time loss and reduced productivity occur due to specimen destruction
Solution Approach 1:
The non-destructive X-ray characterization system allows the specimen to serve itself for multiple measurements and quality control checks without requiring extraction or destruction. The same specimen can be repeatedly measured and then returned to the manufacturing process, eliminating time loss associated with preparing multiple test samples.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables non-destructive characterization of specimens, reducing the need for destructive sampling and facilitating high-volume manufacturing by providing accurate structural information without physical alteration of the specimen.
Implementation Method 1
an electron beam (e-beam) source for projecting e-beams at one or more e-beam landing energies on a specimen being tested
Implementation Method 2
an X-ray detector for sensing X-rays emitted from the tested specimen
Data Source
AI summary
Disclosed herein is a system for non-destructive characterization of specimens. The system includes an electron beam (e-beam) source for projecting e-beams at one or more e-beam landing energies on a specimen; an X-ray detector for sensing X-rays emitted from the specimen, thereby obtaining measurement data; and a processing circuitry. The processing circuitry is configured to: (i) extract from the measurement data key features specified by a vector {right arrow over (f)}key; and (ii) determine values {right arrow over (p)} of one or more structural parameters, characterizing the specimen, based on {right arrow over (f)}key and a set of vectors of simulated key features {{right arrow over (f)}n}n=1N. Each of the {right arrow over (f)}n is a product of a computer simulation of emission of X-rays from a respective simulated specimen due to impinging thereof with e-beams at each of the one or more landing energies.


