X-ray Substrate Evaluation for Deep Structure Analysis
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Solution Overview
Problem
Evaluating deep structures such as holes and trenches is challenging due to the failure of secondary and backscattered electrons emitted from their bottoms to exit, making it difficult to assess their status efficiently and reliably.
Innovation Solution
A method involving acquiring an electron image and an x-ray image of a substrate structure, with the evaluation based on the number of x-ray photons emitted, which includes selecting a sub-region for x-ray imaging to enhance acquisition speed and throughput, and using a charged particle system with optics and a processor to process the images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electron imaging is used to evaluate deep structures, then the method is widely applicable to various structures, but the measurement precision deteriorates because secondary electrons and backscattered electrons emitted from the bottom of deep structures fail to exit
Solution Approach 1:
The patent introduces x-ray photons as an intermediary detection mechanism. Instead of relying on electrons that cannot escape deep structures, the system uses x-ray photons generated by electron-beam excitation of the substrate, which can penetrate and exit deep structures to provide evaluation information about their status.
2Measurement precision
If x-ray imaging is used to evaluate deep structures, then the measurement precision improves due to higher signal-to-noise ratio, but the device complexity increases requiring additional x-ray detection capabilities
Solution Approach 1:
The patent merges x-ray detection capabilities with the existing electron-beam imaging system. The x-ray detector is integrated into the charged particle system, allowing simultaneous or sequential acquisition of electron images and x-ray images without requiring completely separate systems, thereby managing complexity while achieving improved measurement precision.
3Reliability
If full substrate imaging is performed, then complete coverage is achieved, but the productivity decreases due to time-consuming acquisition process
Solution Approach 1:
The patent segments the imaging process into two modes: electron imaging for comprehensive structural overview and x-ray imaging for targeted deep structure evaluation. By dividing the evaluation task between these two methods with complementary strengths, the system achieves both complete coverage and efficient processing, improving productivity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a more efficient and reliable evaluation of deep structures by leveraging the higher signal-to-noise ratio of x-ray photons, facilitating defect classification and status determination with reduced computational resources.
Implementation Method 1
acquiring an x-ray image of the structure; evaluating the status of the structure, wherein the evaluating is based at least on a number of x-ray photons that were emitted from the structure
Data Source
AI summary
A method for x-ray based evaluation of a status of a structure of a substrate, the method may include acquiring an electron image of a region of the substrate, the region comprises the structure; acquiring an x-ray image of the structure; and evaluating the status of the structure, wherein the evaluating is based at least on a number of x-ray photons that were emitted from the structure.