XRF Marking for Electronic Component Authentication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current XRF techniques lack a unified marking/coding system for authenticating and verifying the compatibility of electronic components in composite systems, particularly in medical devices and wearable technology, which is crucial for ensuring authenticity, security, and supply chain management.
Innovation Solution
The implementation of a unified XRF marking/coding system, referred to as One Board One Code (OBOC), uses elemental markers embedded in electronic components to provide unique XRF signatures that can be read to verify compatibility, authenticity, and track components through the supply chain, ensuring that only authorized and genuine components are used.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional inspection techniques are used for electronic components, then existing processes can be maintained, but there is no unified marking system for authentication and compatibility verification
Solution Approach 1:
The patent applies universality by creating a unified XRF marking system that serves multiple functions: authentication of genuine components, verification of compatibility between components, tracking through supply chain, and enabling both manufacturing process control and post-manufacturing verification. This single marking system replaces the need for multiple separate identification systems.
Solution Approach 2:
The patent utilizes parameter changes by encoding information in the concentrations of XRF-active elements within the marking composition. Different components receive markings with specific elemental compositions and concentrations that encode their identity, compatibility information, and authentication data. The XRF reader detects these parameter variations to verify component properties.
2Measurement precision
If XRF marking compositions with XRF-active elements are applied to electronic components, then unique signatures can be generated for authentication, but the marking process adds complexity to manufacturing
Solution Approach 1:
The patent applies preliminary action by incorporating XRF-active elements into the marking compositions during the component manufacturing process itself, rather than adding them later. The markings are applied to components at designated locations during assembly, enabling authentication and compatibility verification to be built into the manufacturing workflow rather than added as a separate post-processing step.
Solution Approach 2:
The patent uses copying by creating physical markings on components that contain encoded information about their identity and compatibility. These physical markings with specific elemental compositions serve as copies of the component's authentication data, which can be read and verified without altering the functional components themselves.
3Reliability
If multiple electronic components are marked with corresponding XRF signatures, then compatibility can be verified, but the system requires coordinated marking of all components
Solution Approach 1:
The patent implements feedback by using XRF readers to detect the markings on components and provide verification feedback on their compatibility and authenticity. The system reads the XRF signatures from multiple components, compares them against each other and against expected patterns, and provides immediate feedback on whether the components are compatible and genuine, enabling real-time verification during assembly or inspection.
Solution Approach 2:
The patent applies merging by combining multiple verification functions into a single XRF-based system. The same marking compositions with XRF-active elements provide authentication, compatibility information, and tracking data simultaneously. The XRF reader integrates multiple detection functions to verify all aspects of component legitimacy in a single measurement process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables secure authentication and verification of electronic components, prevents counterfeiting, and ensures that components are correctly assembled and matched, thereby enhancing the reliability and security of electronic systems, especially in medical and wearable devices.
Implementation Method 1
a first marking composition comprising first XRF-active elements and configured for emitting a first signal having a first spectral composition in response to irradiation by XRF interrogation radiation
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
Methods and systems for verifying compatibility of components (e.g. parts or devices) of an electronic system are disclosed. In certain embodiments the method includes: irradiating a first and second components presumably associated with the electronic system, with XRF exciting radiation, and detecting one or more XRF response signals indicative of a first and a second XRF signatures, emitted from the first and second components in response to the irradiation. Then the first and second XRF signatures are processed to determine whether they are associated with respectively a first and second XRF marking compositions on the first and second components, and the compatibility of the first and second components to the electronic system is determined/verified based on the correspondence between the first and a second XRF signatures/marking. Certain embodiments also disclose electronic systems including at least a first and a second electronic components/devices respectively having the first and second XRF marking compositions that enable verification of compatibility of the components. Certain embodiments disclose techniques for pairing the first and second components (e.g. devices) based a correspondence between the first and second XRF signatures/markings thereof. Certain embodiments disclose various calibration techniques for calibrating the XRF measurements of XRF markings applied to different substrate materials of the electronic components.