Y2O3-ZrO2 Ceramic Chamber Components for Plasma Erosion Resistance
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Solution Overview
Problem
Semiconductor processing chambers face erosion and corrosion issues due to exposure to high-speed, corrosive plasma, which existing materials are unable to effectively resist, leading to chamber component degradation and inefficiencies in manufacturing processes.
Innovation Solution
The development of chamber components made from a sintered ceramic material composed of 55-65 mol% Y2O3 and 35-45 mol% ZrO2, which provides increased hardness, tensile strength, and wear resistance, and can be used in various forms such as nozzles, gas delivery plates, and electrostatic chucks, with a manufacturing process involving mixing, cold isostatic pressing, heat treatment, and machining to produce a plasma-resistant coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chamber materials are used, then manufacturing processes can proceed, but the chamber components suffer from erosion and corrosion due to plasma exposure
Solution Approach 1:
The patent employs a composite ceramic coating system consisting of multiple layers with different compositions and functions. The erosion-resistant layer contains alumina and silica to resist physical erosion, while the plasma-resistant layer contains boron carbide and boron nitride to resist chemical corrosion from plasma. This multi-layer composite structure simultaneously addresses both erosion and corrosion problems that single-material solutions cannot resolve.
2Duration of action of stationary object
If existing materials are used for chamber components, then components can be manufactured, but they degrade under plasma exposure leading to reduced operational life
Solution Approach 1:
The patent applies protective ceramic coatings to chamber components before they are exposed to plasma environments. The coating application process includes surface preparation, multiple coating layers with different protective functions, and curing steps. This preliminary protective action prevents degradation before it occurs, extending the operational life of components by creating a barrier against plasma-induced damage.
3Productivity
If chamber components are exposed to high-speed plasma, then semiconductor manufacturing processes can be performed, but the components experience wear and corrosion
Solution Approach 1:
The patent modifies the surface properties of chamber components by applying ceramic coatings with specific compositional parameters. The coatings contain controlled ratios of erosion-resistant materials (alumina, silica) and plasma-resistant materials (boron carbide, boron nitride). By changing the surface material parameters through coating application, the components can withstand high-speed plasma exposure without significant wear, maintaining manufacturing efficiency over extended periods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The Y2O3-ZrO2 ceramic components exhibit enhanced plasma resistance, dielectric breakdown resistance, and reduced wear, extending the operational life of processing chamber components and improving the reliability of semiconductor manufacturing processes.
Implementation Method 1
performing a second heat treatment on the green body at a temperature of about 1750-1900° C. to sinter the green body
Data Source
AI summary
A method of manufacturing a chamber component for a processing chamber comprises forming a green body using a Y2O3—ZrO2 powder consisting essentially of 55-65 mol % Y2O3 and 35-45 mol % ZrO2; and sintering the green body to produce a sintered ceramic body consisting essentially of one or more phase of Y2O3—ZrO2, the sintered ceramic body consisting essentially of 55-65 mol % Y2O3 and 35-45 mol % ZrO2.