Y4Al2O9 Composite Coating for Low-Particle Plasma Resistance
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Solution Overview
Problem
Semiconductor manufacturing devices face challenges in achieving low-particle generation due to plasma corrosion, particularly with the advancement of miniaturization, where existing ceramic coatings do not adequately resist fluorine-based plasmas.
Innovation Solution
A composite structure with Y4Al2O9 as the main component, having an indentation hardness greater than 6.0 GPa, is used to enhance low-particle generation by forming a ceramic coat on a substrate, which is resistant to corrosive fluorine-based plasmas, and can be applied as a member within semiconductor manufacturing devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If oxide-based ceramics such as alumina and yttria are used for coating, then plasma resistance is improved, but particle generation increases under fluorine-based plasma corrosion
Solution Approach 1:
The invention changes the material parameters by selecting Y4Al2O9 (YAM) ceramic with specific physical and chemical properties including indentation hardness greater than 6.0 GPa, specific density range, and particular thermal expansion coefficient, thereby achieving both plasma resistance and low particle generation
Solution Approach 2:
The invention uses Y4Al2O9 ceramic as a coating layer on a substrate, creating a composite structure that combines the advantages of ceramic material (plasma resistance) with controlled hardness properties (low particle generation), resolving the contradiction between durability and contamination
2Productivity
If miniaturization of semiconductor devices is advanced, then device performance is improved, but the requirement for low-particle generation becomes more stringent
Solution Approach 1:
The invention addresses the stricter contamination requirements by changing the material parameters of the ceramic coating, specifically selecting Y4Al2O9 with indentation hardness >6.0 GPa, which demonstrates superior resistance to particle generation in miniaturized semiconductor manufacturing environments
3Reliability
If ceramic coating is applied to substrate, then plasma corrosion resistance is improved, but hardness control becomes critical to prevent particle generation
Solution Approach 1:
The invention resolves this contradiction by precisely controlling the hardness parameter of the ceramic coating through material selection, specifying that Y4Al2O9 ceramic with indentation hardness greater than 6.0 GPa should be used, thereby achieving both corrosion resistance and appropriate hardness for low particle generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite structure effectively reduces particle generation by maintaining crystal structure integrity and lowering fluorine atom concentration, even under exposure to corrosive plasmas, thereby improving the performance of semiconductor manufacturing devices.
Implementation Method 1
the structure contains Y4Al2O9 as a main component, and an indentation hardness thereof is greater than 6.0 GPa... resistant to corrosive fluorine-based plasmas
Data Source
AI summary
Disclosed are a composite structure, which is able to enhance low-particle generation so that this can be used as a member for a semiconductor manufacturing device, and a semiconductor manufacturing device provided with the composite structure. The composite structure has a substrate and a structure that is provided on the substrate and has a surface, in which the structure contains Y4Al2O9 as a main component, and an indentation hardness thereof is greater than 6.0 GPa, thereby having excellent low-particle generation, so that this may be suitably used as a member for a semiconductor manufacturing device.