Yarn Wire PCB Through-Hole Bonding Without Solder Heat
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Yarn wires, being stretchable and electrically conductive, face challenges in transmitting electrical signals under high temperatures without losing stretchability, as traditional connection methods like welding with solder are not suitable and can be harmful.
Innovation Solution
A connection method involving a yarn wire and a circuit board using a through hole, a jig, and adhesives to create a protruding wire segment that secures the yarn wire to the circuit board, ensuring electrical conductivity and stability without solder, allowing for eco-friendly assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional welding with solder is used to connect yarn wire to circuit board, then electrical signal transmission is achieved, but the yarn wire cannot withstand the high temperature and loses stretchability
Solution Approach 1:
The patent extracts and eliminates the solder from the connection process entirely. Instead of using traditional welding with solder, the invention uses a mechanical insertion method where the yarn wire is directly inserted through a through-hole in the circuit board and fixed with adhesive, completely avoiding the high-temperature soldering process that damages the yarn wire's stretchability.
Solution Approach 2:
The patent introduces an intermediary adhesive material to achieve electrical connection without direct welding. The adhesive serves as a mediator that bonds the yarn wire to the circuit board while maintaining the yarn's stretchable properties, replacing the traditional solder intermediary that causes high-temperature damage.
2Reliability
If solder is used for connection, then electrical conductivity is achieved, but the connection process becomes harmful to the environment due to toxic materials
Solution Approach 1:
The patent extracts and removes solder and other harmful connection materials from the process. By using adhesive-based fixation instead of soldering, the invention eliminates toxic substances from the connection process, making it environmentally friendly while maintaining electrical conductivity.
Solution Approach 2:
The patent replaces expensive and harmful solder materials with inexpensive, environmentally benign adhesive materials. This substitution uses cheap, non-toxic alternatives that achieve the same functional purpose without the environmental drawbacks of traditional soldering materials.
3Ease of operation
If yarn wire is stretched to pass through the through hole, then connection is achieved, but the yarn wire diameter changes and may affect fit
Solution Approach 1:
The patent utilizes the dynamic property of the yarn wire, which can change its diameter through stretching and relaxation. The yarn is stretched during insertion to pass through the through-hole, then relaxes to its original diameter, creating a secure fit. This dynamic dimension change enables easy insertion while maintaining precise fit after the process.
Solution Approach 2:
The patent changes the physical parameter of the yarn wire diameter temporarily during the connection process. By stretching the yarn to reduce its diameter for insertion, then allowing it to return to its original diameter, the process achieves both ease of operation and manufacturing precision without contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables rapid and stable connection of yarn wires to circuit boards, maintaining stretchability and conductivity while avoiding high-temperature materials, facilitating eco-friendly assembly.
Implementation Method 1
the yarn wire applies a frictional force and an abutting normal force on an inner wall of a periphery of the through hole
Implementation Method 2
adhering a fixing back adhesive to one side of the circuit board, in which the fixing back adhesive is adhered to the circuit board and the protruding wire segment
Data Source
AI summary
A connection method for a yarn wire and a circuit board includes steps as follows: providing at least one yarn wire, a back adhesive, and a circuit board, at least one through hole is formed on the circuit board, and a diameter D of the through hole, a diameter d of the at least one yarn wire, a shrunken diameter dmin of the yarn wire being stretched, and a jig thickness t of a jig have a relation of: 2d>D>2dmin+t; placing the yarn wire on the back adhesive, aligning the yarn wire having the back adhesive with the through hole, and extruding and passing the yarn wire through the through hole by using the jig to penetrate the back adhesive; pulling the jig out along a pulling direction; and adhering a fixing back adhesive to one side of the circuit board.