Plasma-Resistant Yttria Coating for Semiconductor Chamber Stability
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Solution Overview
Problem
In semiconductor manufacturing, existing plasma-resistant members fail to maintain stable chamber conditions and reduce particle occurrence effectively, especially with advancing nanolevel particle control and pattern downscaling.
Innovation Solution
A plasma-resistant member with a base material coated by an aerosol-deposited yttria polycrystalline body layer, featuring a mixed cubic and monoclinic crystal structure, crystallite sizes between 8 nm and 50 nm, and a dense structure to enhance plasma resistance and chemical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional plasma-resistant members are used, then chamber conditions are maintained, but particle detachment occurs and yield stability deteriorates
Solution Approach 1:
The invention changes the crystal structure parameters of yttria by controlling the monoclinic to cubic ratio (0-60%) and crystallite size (8-50 nm) to optimize plasma resistance and eliminate particle detachment while maintaining yield stability
Solution Approach 2:
The invention uses a composite coating structure with base material and aerosol-deposited yttria layer, combining different material properties to achieve both plasma resistance and particle-free operation for improved yield stability
2Object-generated harmful factors
If yttria film coating is applied to reduce particles, then particle occurrence decreases, but nanolevel particle control stability is insufficient
Solution Approach 1:
The invention precisely controls crystallite size (8-50 nm) and crystal structure (monoclinic to cubic ratio 0-60%) to achieve stable nanolevel particle control, going beyond conventional yttria film coating to provide both particle reduction and nanolevel stability required for pattern downscaling
3Reliability
If aerosol deposition is used with controlled crystal structure, then plasma resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The invention optimizes aerosol deposition parameters including monoclinic to cubic ratio (0-60%) and crystallite size (8-50 nm) to achieve high plasma resistance, balancing manufacturing complexity with improved reliability for semiconductor chamber applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces particle production and maintains stable chamber conditions by improving plasma resistance and chemical stability, ensuring higher yield and reduced discrepancies in semiconductor devices.
Implementation Method 1
a layer structural component formed by aerosol deposition at a surface of the base material
Implementation Method 2
the layer structural component is plasma-resistant and includes an yttria polycrystalline body
Data Source
AI summary
There is provided a plasma-resistant member, including: a base material; and a layer structural component formed by aerosol deposition at a surface of the base material, the layer structural component being plasma-resistant and including an yttria polycrystalline body, the yttria polycrystalline body included in the layer structural component having a crystal structure in which cubic and monoclinic coexist, a proportion of monoclinic to cubic inside the yttria polycrystalline body included in the layer structural component being not less than 0% and not more than 60%, a crystallite size of the yttria polycrystalline body included in the layer structural component being not less than 8 nm and not more than 50 nm.