Yttrium ALD Precursor Composition for Low-Melting Stable Thin Films

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Solution Overview

Problem

Existing thin-film forming raw materials for atomic layer deposition (ALD) methods lack thermal stability, have high melting points, and result in high residual carbon content, limiting high-productivity production of high-quality thin-films.

Innovation Solution

A thin-film forming raw material comprising an yttrium compound with a specific structure, represented by general formula (1), is used in the ALD method, featuring low melting point and high thermal stability, allowing for the production of high-quality thin-films with reduced residual carbon content.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional yttrium compounds are used as thin-film forming raw materials for ALD method, then the raw materials can be used in CVD method, but they lack thermal stability and have high melting points making them unsuitable for ALD method

Engineering Contradiction:
Improvethermal stabilityVSAvoidmelting point
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent changes the chemical structure parameters of the yttrium compound by selecting specific β-diketone ligands with particular R1, R2, and R3 groups. This structural parameter change results in compounds with lower melting points and higher thermal stability, making them suitable for ALD method while maintaining CVD method applicability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates composite molecular structures combining yttrium metal center with specifically designed organic β-diketone ligands. This composite approach allows tuning of physical properties (melting point and thermal stability) while maintaining the yttrium component's functionality for thin-film formation in both CVD and ALD methods.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If conventional yttrium compounds are used in ALD method, then thin-films can be produced, but the residual carbon content is high reducing film quality

Engineering Contradiction:
Improvethin-film qualityVSAvoidresidual carbon content
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

The patent changes the ligand structure parameters (R1, R2, R3 groups) to optimize the carbon content and decomposition characteristics of the precursor. This parameter optimization reduces residual carbon in the final thin-film while maintaining the compound's effectiveness as an ALD raw material.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If conventional yttrium compounds are used in ALD method, then production can proceed, but productivity is low due to high melting points and poor thermal stability

Engineering Contradiction:
Improveproduction efficiencyVSAvoidthermal stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent optimizes the molecular structure parameters of the yttrium compound to achieve lower melting points and improved thermal stability. These parameter changes enable more efficient processing conditions in ALD method, thereby improving productivity while maintaining or enhancing thermal stability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The yttrium compound enables high-productivity production of high-quality thin-films with improved thermal stability and reduced residual carbon content, suitable for applications in atomic layer deposition methods.

Implementation Method 1

causing the yttrium compound in a raw material gas, which is obtained by vaporizing the thin-film forming raw material, to adsorb to the surface of the substrate to form a precursor thin-film

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

causing the precursor thin-film to react with a reactive gas to form the thin-film containing an yttrium atom on the surface of the substrate

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 3

causing the yttrium compound in a raw material gas, which is obtained by vaporizing the thin-film forming raw material

Methodology Applied
Scientific EffectVaporization: Evaporation

Data Source

PatentUS12509764B2Thin-film forming raw material used in atomic layer deposition method, and method of producing thin-film
Publication Date: 2025.12.30 ADEKA CORP
  • US12509764B2 patent drawing
  • US12509764B2 patent drawing
  • US12509764B2 patent drawing

AI summary

Provided is a thin-film forming raw material, which is used in an atomic layer deposition method, including an yttrium compound represented by the following general formula (1):where R1 represents a secondary alkyl group having 3 to 8 carbon atoms, R2 represents a tertiary alkyl group having 4 to 8 carbon atoms, and R3 represents a hydrogen atom, or a primary, secondary, or tertiary alkyl group having 1 to 5 carbon atoms.