Yttrium Oxide Ceramic Member with Carbon Nanotubes
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Solution Overview
Problem
Ceramic members integrated with insulating and conductive ceramics using adhesives or mechanical joining face thermal expansion mismatches, leading to issues like cracking, detachment, and reduced thermal conductivity in semiconductor-manufacturing apparatuses, particularly in high-temperature plasma environments.
Innovation Solution
A ceramic member is created by adhering or joining conductive ceramics with 0.1-3 volume % fibrous conductive substances, such as carbon nanotubes, to insulating yttrium oxide ceramics using an inorganic adhesive, ensuring matched thermal expansion coefficients and maintaining high corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If insulating ceramic and conductive ceramic are adhered using an adhesive, then both insulating and conductive functions are achieved, but thermal expansion mismatch causes breakage or cracking in the adhesive layer at high temperatures
Solution Approach 1:
The patent uses yttrium oxide as the base material for both insulating and conductive ceramics, ensuring homogeneous composition and matched thermal expansion coefficients. This eliminates thermal expansion mismatch and prevents adhesive layer cracking at high temperatures while maintaining both insulating and conductive functions.
Solution Approach 2:
The patent creates composite ceramic structures where yttrium oxide serves as the common matrix, with conductive additives (metal particles, carbides, or nitrides) embedded within. This composite approach achieves both insulating and conductive properties while maintaining thermal expansion compatibility through the shared yttrium oxide base.
2Temperature
If inorganic-based adhesive is used to adhere ceramics, then heat resistance is improved, but thermal expansion coefficient cannot be matched to both ceramics, leading to detachment at interfaces
Solution Approach 1:
By using yttrium oxide as the common base material for both ceramics, the patent ensures that the thermal expansion coefficients are inherently matched. This homogeneous approach eliminates interface detachment issues even when using inorganic adhesives with limited thermal expansion adjustment capability.
3Reliability
If mechanical joining is used to connect ceramics, then adhesive corrosion resistance is improved, but thermal expansion mismatch causes stress and potential breakage
Solution Approach 1:
The patent uses yttrium oxide as the common base material for both insulating and conductive ceramics, ensuring homogeneous composition and matched thermal expansion coefficients. This eliminates thermal expansion mismatch and prevents stress-induced breakage in mechanically joined structures.
4Reliability
If buffer layer is inserted between ceramics to solve thermal expansion mismatch, then thermal expansion compatibility is improved, but thermal conduction is inhibited and heat accumulates at the interface
Solution Approach 1:
By using yttrium oxide as the common base material for both ceramics, the patent achieves thermal expansion compatibility without requiring any buffer layers. This homogeneous approach maintains direct ceramic-to-ceramic contact, ensuring efficient thermal conduction while preventing thermal expansion mismatch.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes thermal expansion mismatches, preventing breakage, cracking, and detachment, while maintaining excellent corrosion resistance and conductivity, ensuring reliable performance in high-temperature semiconductor-manufacturing processes.
Implementation Method 1
conductive ceramics, such as silicon carbide (SiC), and combined ceramics that are combined by adding a conductive material, such as silicon carbide (SiC), carbon (C) or metal
Implementation Method 2
adhering both ceramics using an adhesive or mechanically joining both ceramics using clamps, screws, bolts
Implementation Method 3
ceramic materials which are materials having excellent corrosion resistance with respect to plasma or corrosive halogen gas
Data Source
AI summary
Provided is a ceramic member in which the difference in thermal expansion coefficient between an insulating ceramic material and an electrically conductive ceramic material is extremely small and therefore any mismatch caused in association with this difference in thermal expansion coefficient does not occur, and which does not undergo any failure such as breakage, cracking, detachment or destruction. The ceramic member (1) includes an electrically conductive ceramic material (2) which contains yttrium oxide as the main component and additionally contains a fibrous electrically conductive substance such as carbon nanotubes in an amount of 0.1 to 3 vol % inclusive and an insulation ceramic material (3) which contains yttrium oxide as the main component, wherein the electrically conductive ceramic material (2) and the insulation ceramic material (3) are adhered to each other in an integrated manner through an adhesive layer (4) which includes an inorganic adhesive material.