Z-Axis Meandering Patch Antenna for Resonant Frequency Reduction
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Solution Overview
Problem
Planar antennas, such as circular patch antennas, are difficult to miniaturize without increasing resonant frequencies, and their fabrication into three-dimensional meandering structures poses challenges due to the need for undulating substrates and conductive layers.
Innovation Solution
The use of additive manufacturing techniques like 3D printing for forming dielectric substrates with undulating patterns and depositing conductive ink to create meandering antenna structures, allowing for complex three-dimensional shapes that reduce resonant frequencies and provide improved radiation characteristics while maintaining a similar mechanical footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the radius of a circular patch antenna is reduced to miniaturize the antenna, then the antenna footprint is reduced, but the resonant frequency increases
Solution Approach 1:
The patent transitions from a two-dimensional planar antenna structure to a three-dimensional meandering structure by adding vertical undulations to the substrate. This dimensional change allows the antenna to maintain a reduced footprint while achieving the required resonant frequency through the extended electrical path length provided by the meandering configuration.
Solution Approach 2:
The patent introduces curved undulating patterns to the substrate surface, creating a meandering path for the conductive regions. These curved geometries increase the electrical path length without increasing the planar footprint, thereby maintaining the desired resonant frequency in a compact form factor.
2Reliability
If a Z-meandering configuration with undulating substrate is used to reduce resonant frequency, then the resonant frequency and footprint are improved, but the fabrication complexity increases
Solution Approach 1:
The patent modifies the substrate geometry parameter by introducing controlled undulations with specific amplitudes and wavelengths. These parameter changes create the meandering effect that reduces resonant frequency while the undulating substrate can be fabricated using standard techniques, managing the complexity through defined geometric parameters.
Solution Approach 2:
The patent divides the conductive region into multiple segments that follow the undulating substrate profile. This segmentation allows the conductive layers to be applied in a systematic manner across the complex three-dimensional surface, making the fabrication process more manageable while achieving the desired meandering configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves a reduction in resonant frequency, weight, and footprint, while enhancing radiation efficiency and bandwidth, with simulated and measured results showing a 21.12% reduction in antenna area and an 8% decrease in resonant frequency from 5 GHz to 4.6 GHz, maintaining antenna gain.
Implementation Method 1
a dielectric substrate can be formed using fused deposition of a polymer material (e.g., using an additive manufacturing approach such as a three-dimensional printing or '3D printing' approach)
Implementation Method 2
One or more conductive regions can be formed such as using a conductive ink deposited on a dielectric layer
Data Source
AI summary
Apparatus and techniques described herein can include antenna configurations and related fabrication. For example, a Z-axis meandering antenna configuration can be fabricated, such as by forming a dielectric substrate extending in two dimensions and defining an undulating region extending out of a plane defined by the two dimensions; and forming at least one conductive region following a contour of the dielectric substrate including at least a portion of the undulating region. The at least one conductive region can follow the contour of the dielectric substrate, such as including a first conductive region on a first layer, and a second conductive region on another layer separate from the first conductive region of the first conductive layer.