Z-axis MEMS Mounting via Surface Tension Alignment

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Solution Overview

Problem

Mounting z-axis MEMS sensing devices in compact devices with limited space and high volume is challenging due to their tall and thin configuration, making precise vertical alignment difficult and costly.

Innovation Solution

The z-axis MEMS sensing device is configured with a height less than or equal to its width and a longer length, allowing for precise vertical alignment by mounting it on a short z-axis, using surface tension and a bonding pattern on a substrate or lead frame, with bond pads arrayed on opposing longitudinal sides for perpendicular alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If z-axis MEMS sensing devices are mounted in a tall and thin configuration, then the device height is minimized for compact packaging, but precise vertical alignment becomes extremely difficult and costly

Engineering Contradiction:
Improvedevice heightVSAvoidvertical alignment precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the mounting orientation from vertical (z-axis) to horizontal (x-y plane), transforming the alignment problem from a difficult vertical dimension to an easier horizontal dimension. The elongate device is mounted with its length in the x-direction and width in the y-direction, allowing standard horizontal alignment techniques to achieve precise orientation without the complexity of vertical alignment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent utilizes the asymmetric geometry of the elongate MEMS device, where the length (x-dimension) is significantly greater than the width (y-dimension) and height (z-dimension). This asymmetry is exploited by mounting the device horizontally with the long dimension in the x-direction, creating a stable, easily alignable configuration that avoids the difficulties of aligning the short height dimension vertically.

Inventive Principle:
Principle #4Asymmetry

2Reliability

If z-axis MEMS sensing devices are mounted vertically on a substrate, then the sensing function is achieved, but the mounting process becomes complex and costly for high volume production

Engineering Contradiction:
Improvesensing functionVSAvoidmounting process simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent inverts the conventional mounting approach by mounting the z-axis sensing device horizontally on the substrate plane instead of vertically. The device is oriented with its length in the x-direction and width in the y-direction, allowing it to be mounted using standard horizontal placement techniques rather than requiring complex vertical alignment and attachment processes.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent changes the orientation parameters of the MEMS device from vertical (z-axis mounting) to horizontal (x-y plane mounting). By rotating the device 90 degrees and mounting it with its length along the x-axis and width along the y-axis, the mounting process becomes compatible with standard manufacturing techniques, significantly improving ease of manufacture for high volume production.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate vertical mounting in mass production with reduced costs and facilitates integration with compact packaging technologies like LGA, BGA, QFN, TLA, and HLA, while maintaining precise orientation and alignment.

Implementation Method 1

This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS8387854B2Method for mounting a three-axis MEMS device with precise orientation
Publication Date: 2013.03.05 MEMSIC
  • US8387854B2 patent drawing
  • US8387854B2 patent drawing

AI summary

This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane. According to the teachings of the present invention, the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions. As a result, instead of being thin and tall like a wall, which configuration is extremely difficult to align vertically, the elongate z-axis sensing device is mounted on a short z-axis, making it easier to align vertically.