Z-Axis Stacked Circuit Boards for Compact Component Integration
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Solution Overview
Problem
Existing technologies fail to integrate more components in a limited space, as the size of the circuit board decreases, and the problem is exacerbated by the need to efficiently utilize the space for additional components.
Innovation Solution
The solution involves stacking multiple circuit boards in the Z-axis direction, where each circuit board has different surface configurations to maximize the use of the Z-axis space, allowing for a greater number of components to be integrated without increasing the horizontal plane size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more components are integrated on a circuit board, then component integration is improved, but the circuit board size must decrease, resulting in insufficient layout area
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked architecture by placing multiple circuit boards in the Z-axis direction. This dimensional change allows components to be arranged vertically rather than only horizontally, effectively increasing the layout area without expanding the horizontal footprint of the device.
Solution Approach 2:
The patent implements a nested structure where multiple circuit boards are stacked one on top of another in the Z-axis direction. This nesting approach allows multiple layers of components to be integrated within the same horizontal space, thereby increasing the total number of components while maintaining a compact layout area.
2Volume of moving object
If the circuit board size decreases to accommodate battery life and capacity increases, then device compactness is improved, but the layout area becomes insufficient
Solution Approach 1:
The patent resolves the contradiction between device compactness and layout area by utilizing the Z-axis dimension. Multiple circuit boards are stacked vertically, allowing the device to maintain a small horizontal footprint while providing sufficient layout area through vertical expansion. This effectively decouples the relationship between device volume and layout area.
Solution Approach 2:
The patent divides the circuit board functionality into multiple separate circuit boards that are stacked together. Each circuit board can be optimized independently for specific functions, and the stacked arrangement provides sufficient total layout area while keeping each individual board compact, thus resolving the contradiction between device compactness and layout area.
Data Source
AI summary
Embodiments of this application provide an electronic device. The electronic device includes: a housing structure, including at least a first part and a second part; and a circuit board assembly, located on a side of the housing structure. The circuit board assembly includes at least a first circuit board and at least one second circuit board that are stacked. A distance from the first part to the first circuit board is greater than a distance from the second part to the first circuit board. The quantity of the circuit board assembly corresponding to the first part which functional component are provided is a first preset value. The quantity of the circuit board assembly corresponding to the second part which functional component are provided is a second preset value. The first preset value is greater than the second preset value.