Z-Connection Microelectronic Package Electroless Plating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In microelectronic packages, the limited space on the substrate for interconnecting elements in stackable configurations restricts the number of connections, requiring large intervals for solder balls or conductive connections to bridge gaps, which limits the density of interconnections.
Innovation Solution
The use of continuous electroless plated metal regions between conductors on a substrate and a dielectric element, formed by electrolessly plating metals like cobalt, nickel, or copper, allows for closer spacing and higher conductor density by eliminating the need for lithography and reducing production time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls or conductive connections are used to bridge gaps between packages in a stack, then electrical connectivity between packages is achieved, but the interval between interconnecting elements must be large, limiting the density of interconnections
Solution Approach 1:
The patent transitions from discrete point-to-point solder ball connections to continuous plated through-holes that extend vertically through the substrate. This dimensional change allows multiple conductors to be interconnected through the same substrate region, effectively increasing interconnection density without requiring larger spacing between connection points.
Solution Approach 2:
The patent introduces plated through-holes as intermediary conductive pathways within the substrate. These through-holes act as mediators that electrically connect conductors on different surfaces and layers, enabling dense interconnections while maintaining reliable electrical connectivity between stacked packages.
2Manufacturing precision
If lithography processes are used to create conductive patterns for interconnections, then precise conductor spacing can be achieved, but production time and manufacturing complexity increase
Solution Approach 1:
The patent replaces complex lithography and photopatterning processes with electroless plating. Instead of using light-based lithography to define conductor patterns, the invention uses chemical deposition to create conductive plated through-holes, significantly reducing manufacturing steps and production time while maintaining precise conductor spacing.
Solution Approach 2:
The patent extracts and eliminates the lithography step from the manufacturing process. By removing the need for photopatterning and complex lithographic alignment, the invention simplifies the production process, reduces manufacturing complexity, and decreases production time while still achieving precise conductor positioning through the plating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a finer pitch between conductors and a higher density of interconnections, enhancing the electrical connectivity and reducing manufacturing costs and complexity.
Implementation Method 1
continuous electroless plated metal regions that electrically connect pairs of conductors at respective surfaces thereof
Data Source
AI summary
An assembly includes a substrate having a substrate conductor and a contact at a first surface and a terminal at a second surface for electrically interconnecting the assembly with a component external to the assembly, at least one of the substrate conductor or the contact electrically coupled with the terminal. A first element has a first surface facing the first surface of the substrate, a first conductor at the first surface and a second conductor at a second surface. An interconnect structure may extend through the first element electrically coupling the first and second conductors. An adhesive layer may bond first surfaces of the first element and the substrate, and at least portions of the first conductor and the substrate conductor may be beyond an edge of the adhesive layer. A continuous electroless plated metal region may extend between the first conductor and the substrate conductor.