Z-Directed PCB Components with Conductive Channels for EMI Reduction

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Solution Overview

Problem

High-frequency circuits face challenges with transmission line impedance discontinuities and electromagnetic interference (EMI) due to increased component densities and higher frequencies, which affect signal attenuation and parasitic effects.

Innovation Solution

A Z-directed component with a body having a cross-sectional shape insertable into a printed circuit board (PCB) mounting hole, featuring four conductive channels spaced equally around the perimeter to provide a constant transmission line impedance and minimize loop area, thereby reducing EMI.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If higher frequencies are used for operation, then productivity and performance are improved, but transmission line impedance discontinuities and electromagnetic interference increase

Engineering Contradiction:
Improvefrequency of operationVSAvoidelectromagnetic interference
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from traditional planar PCB mounting to three-dimensional Z-directed embedding. The component body extends through the PCB thickness with conductive channels oriented in the Z-direction, creating vertical signal paths that reduce loop area and minimize EMI while maintaining high-frequency performance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The component employs an asymmetric cross-sectional shape that is rectangular rather than circular, allowing optimized positioning of four conductive channels at the corners. This asymmetric arrangement creates balanced current paths that reduce electromagnetic radiation while maintaining constant impedance

Inventive Principle:
Principle #4Asymmetry

2Productivity

If component densities are increased, then productivity is improved, but transmission line impedance discontinuities and parasitic effects worsen

Engineering Contradiction:
Improvecomponent densityVSAvoidsignal integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

By embedding components vertically through the PCB rather than mounting them on the surface, the invention enables higher component density without compromising signal integrity. The through-hole configuration allows closely spaced components while maintaining controlled impedance paths

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The component body serves multiple functions simultaneously: it provides mechanical support, establishes electrical connections through conductive channels, maintains constant impedance, and reduces EMI through minimized loop area. This multi-functionality allows dense packing without sacrificing performance

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If loop area is minimized to reduce EMI, then electromagnetic interference is reduced, but device complexity increases

Engineering Contradiction:
Improveelectromagnetic interferenceVSAvoidcomponent structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The component divides the electrical connection path into four separate conductive channels positioned at the corners of the rectangular cross-section. Each channel provides an independent signal path, collectively minimizing the overall loop area while maintaining structural simplicity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention combines multiple functions into a single integrated component: the body provides mechanical support, the conductive channels establish electrical connections, and the overall geometry minimizes loop area. This merging reduces the number of separate components needed and simplifies the overall system

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS8822838B2Z-directed printed circuit board components having conductive channels for reducing radiated emissions
Publication Date: 2014.09.02 LEXMARK INTERNATIONAL INC
  • US8822838B2 patent drawing
  • US8822838B2 patent drawing
  • US8822838B2 patent drawing

AI summary

A Z-directed component for mounting in a mounting hole in a printed circuit board according to one example embodiment includes a body having a top surface, a bottom surface and a side surface. The body has a cross-sectional shape that is insertable into the mounting hole in the printed circuit board. A portion of the body is composed of an insulator. Four conductive channels extend through a portion of the body along the length of the body. The four conductive channels are spaced substantially equally around a perimeter of the body.