Z-Directed PCB Component for Impedance Control and EMI Reduction
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Solution Overview
Problem
High-frequency circuits face challenges with transmission line impedance discontinuities and electromagnetic interference (EMI) due to loop area, which affect signal attenuation and operation, and existing components do not effectively manage these issues.
Innovation Solution
The development of Z-directed components with conductive channels and side channels that control transmission line impedance and minimize loop area by using materials with specific dielectric and conductive properties, integrated into printed circuit boards to provide constant impedance and reduce EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional surface mount components are used, then component density is limited, but manufacturing simplicity is maintained
Solution Approach 1:
The component transitions from a conventional surface-mount configuration to a Z-directed configuration that extends through the PCB thickness. The conductive channel penetrates the PCB substrate vertically, allowing the component to occupy three-dimensional space rather than only surface area, thereby increasing component density without proportionally increasing manufacturing complexity
Solution Approach 2:
The conductive channel is nested within the PCB substrate itself, with the channel formed through the board material. This integration allows the component to be embedded within the PCB structure rather than mounted on the surface, achieving higher density while utilizing existing PCB manufacturing processes
2Reliability
If transmission line impedance is not controlled, then manufacturing is simpler, but signal attenuation increases at high frequencies
Solution Approach 1:
The invention controls transmission line impedance by carefully controlling the physical parameters of the conductive channel, including its diameter, length, and position within the PCB. By adjusting these geometric parameters, the characteristic impedance can be maintained at a desired value (e.g., 50 ohms) throughout the high-frequency signal path, ensuring signal integrity without requiring complex external impedance matching networks
Solution Approach 2:
The conductive channel provides localized impedance control at the component level rather than requiring global PCB trace design adjustments. The channel's specific dimensions and positioning create a controlled impedance environment exactly where the high-frequency signal passes through the PCB, isolating this critical function to a local region
3Object-affected harmful factors
If loop area is not minimized, then manufacturing is simpler, but electromagnetic interference increases
Solution Approach 1:
The return path for the high-frequency signal is provided through the PCB ground plane in the same vertical plane as the conductive channel, rather than requiring a separate surface-mounted return path. This three-dimensional arrangement creates a tightly coupled signal-return loop that minimizes the enclosed area, thereby reducing electromagnetic interference without adding complex shielding or routing structures
Data Source
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Figure 4A~5H
Figure 6
AI summary
A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having a top surface, a bottom surface and a side surface. Four conductive channels extend through a portion of the body along the length of the body. The four conductive channels are spaced substantially equally around a perimeter of the body. An integrated circuit is mounted on a surface of the printed circuit board. The integrated circuit has a ball grid array that includes four conductive balls electrically connected to a corresponding one of the four conductive channels of the Z-directed component.