Z-Fold Multi-Element Substrate Structure for High-Density Optoelectronics
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Solution Overview
Problem
Current methods for manufacturing flexible optoelectronic devices are costly and complex, with limited resolution and curvature, requiring multiple parts and processing steps, which hinders the development of high-density electronic devices with integrated optical and electrical components.
Innovation Solution
A folded micro-wire substrate structure that integrates electrical conductors, optical elements, and processing components on a single flexible substrate, allowing for improved electrical connectivity, optical attributes, and manufacturability, reducing the number of parts and processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple separate elements are manufactured and aligned, then manufacturing precision can be achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple separate elements (optical elements, electrical conductors, processing components) into a single integrated substrate structure. This merging eliminates the need for separate manufacturing and alignment steps, reducing device complexity while maintaining precision through the unified substrate design.
Solution Approach 2:
The substrate structure serves multiple functions simultaneously - it provides mechanical support, electrical conduction, optical focusing, and processing capabilities all in one component. This multi-functionality reduces the number of separate parts needed while achieving the required precision for each function.
2Ease of manufacture
If conventional manufacturing methods are used, then existing processes can be maintained, but manufacturing cost and complexity increase
Solution Approach 1:
The patent merges multiple processing steps into a single manufacturing process by integrating all components onto one substrate. This consolidation reduces the number of processing steps and manufacturing costs while simplifying the overall production process.
Solution Approach 2:
The substrate is pre-configured with all necessary features (conductor patterns, optical element structures, processing component arrangements) during the manufacturing process itself, eliminating the need for subsequent assembly steps and reducing overall manufacturing complexity.
3Productivity
If limited resolution methods are used, then manufacturing simplicity is maintained, but device density is restricted
Solution Approach 1:
The patent utilizes the substrate's flexibility and foldability parameters to achieve high device density. By folding the substrate into three-dimensional configurations, the effective area for component placement is increased without requiring higher manufacturing resolution, thus maintaining simplicity while enhancing productivity.
Data Source
AI summary
A folded micro-wire substrate structure includes a transparent folded flexible substrate having a first side and a second side opposed to the first side. The flexible substrate has a first portion and a second portion adjacent to the first portion of the flexible substrate. The flexible substrate has at least a first fold between the first and second portions so that the first portion is aligned with the second portion in a perpendicular direction. One or more electrical conductors is located in or on the flexible substrate, at least one electrical component is located on or in the flexible substrate in the first portion. At least one optical element is located on or in the flexible substrate in the second portion located so that the optical element directs light to or from the electrical component.