Anti-Parallel Zener Diode LED Package for ESD Protection

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Solution Overview

Problem

Conventional photoelectric devices with zener diodes and LED elements face challenges in protecting the LED from electrostatic damage, and existing manufacturing methods lack efficiency in integrating these components effectively.

Innovation Solution

A photoelectric device design featuring an electrode structure with insulating tape connecting LED and zener diodes in anti-parallel configuration, surrounded by reflective cups and encapsulants, along with a manufacturing method that involves forming reflective cups on electrode structures and arranging LED and zener diodes within them, ensuring electrical insulation and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If zener diode is arranged beside LED element in LED package, then LED is protected from electrostatic damage, but device complexity increases

Engineering Contradiction:
Improveprotection from electrostatic damageVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the zener diode and LED element into a single integrated LED package structure, where the zener diode is positioned beside the LED element within the same package. This merging approach protects the LED from electrostatic damage while avoiding the complexity of separate protective devices, as the zener diode serves dual purposes: electrostatic protection and potential light-emitting function.

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If conventional manufacturing methods are used for integrating zener diode and LED element, then manufacturing process is simple, but manufacturing efficiency is low

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidintegration complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent employs preliminary action by pre-positioning the zener diode beside the LED element during the package formation process, rather than adding it separately later. The molding compound is applied to enclose both components simultaneously, and wire bonds are established in a coordinated manner. This preliminary integration approach significantly improves manufacturing efficiency while managing the integration complexity through standardized processes.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects LED elements from electrostatic damage while ensuring efficient electrical connection and packaging, enhancing the reliability and performance of the photoelectric devices.

Implementation Method 1

a reflective cup (40)

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS9437585B2Photoelectric device and method of manufacturing the same
Publication Date: 2016.09.06 ADVANCED OPTOELECTRONIC TECH INC
  • US9437585B2 patent drawing
  • US9437585B2 patent drawing
  • US9437585B2 patent drawing

AI summary

A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.