Zero-Edge Flexible Electronic Device with Wavy Interconnects
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Solution Overview
Problem
Current deformable electronic devices, such as wearable consumer electronics, face challenges in reducing production costs and increasing manufacturability due to their rigid and planar manufacturing technologies, which are incompatible with the soft and pliable nature of biological surfaces, and they often have non-emitting/detecting regions that hinder imaging and display applications.
Innovation Solution
A method involving a flexible substrate with spatially separate active sections and wavy metal interconnects, coupled to a carrier substrate using a sacrificial layer and elastomeric layers, allowing for deformation and integration with organic tissue while minimizing edge portions to create a zero-edge electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional rigid and planar manufacturing technologies are used, then manufacturing precision and reliability are improved, but adaptability to soft biological surfaces deteriorates
Solution Approach 1:
The patent employs flexible plastic device substrates instead of rigid substrates to create deformable electronic devices. This allows the devices to conform to soft biological surfaces while maintaining manufacturing precision through established flexible electronics fabrication techniques.
Solution Approach 2:
The patent uses composite material structures combining flexible substrates with electronic components to achieve both adaptability to biological surfaces and functional performance. The composite approach integrates different material properties to resolve the contradiction between rigidity for manufacturing and flexibility for biological compatibility.
2Adaptability or versatility
If flexible plastic device substrates are used, then adaptability to biological surfaces is improved, but production cost increases
Solution Approach 1:
The patent divides the device into modular components including flexible substrates, electronic components, and packaging elements. This segmentation allows for standardized mass production of individual components using conventional techniques, reducing overall production costs while maintaining flexibility.
Solution Approach 2:
The patent performs preliminary packaging and sealing of electronic components before final device assembly. This preliminary action protects components during mass production and shipping, enabling more efficient manufacturing processes and lower costs.
3Strength
If non-emitting/detecting regions are included for structural support, then device strength is improved, but imaging and display area is reduced
Solution Approach 1:
The patent uses flexible packaging structures that provide mechanical strength and protection without requiring large non-functional regions. The flexible films can be thin yet strong, maximizing the active imaging and display area while maintaining device integrity.
Solution Approach 2:
The patent moves structural support functions to the third dimension through layered packaging structures and edge-based reinforcement, rather than using two-dimensional non-emitting regions. This allows the majority of the device surface to be used for imaging and display functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of flexible and stretchable electronic devices that can conform to complex biological surfaces, reduce manufacturing costs, and eliminate non-emitting/detecting regions, enhancing imaging and display capabilities by minimizing visible seams and edge imperfections.
Implementation Method 1
elastomeric layers, allowing for deformation and integration with organic tissue
Implementation Method 2
wavy metal interconnects, coupled to a carrier substrate
Data Source
AI summary
Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.