Zhaga Module Rim Extension for High-Power Thermal Dissipation
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Solution Overview
Problem
The limited dimensions of Zhaga slots restrict the thermal dissipation of add-on modules, limiting their maximum power and preventing the integration of high-power functionalities such as UVC disinfection and Li-Fi communication.
Innovation Solution
An electronic module with a rim extending beyond the standardized boundaries of a Zhaga slot for improved heat dissipation, allowing non-Zhaga compliant modules to connect and provide additional functionalities while maintaining thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the electronic module strictly complies with Zhaga standard dimensions, then it can be universally connected to any Zhaga slot, but the thermal dissipation capability is limited and maximum power is restricted
Solution Approach 1:
The patent extends the heat dissipation structure (rim) beyond the standardized Zhaga module boundaries in the radial dimension, allowing thermal management components to occupy space outside the conventional module footprint while maintaining compatibility with the Zhaga slot insertion interface
Solution Approach 2:
The patent separates the module into distinct functional zones: the Zhaga-compliant insertion portion that maintains standard dimensions for compatibility, and the extended heat dissipation portion that radiates outward to provide enhanced thermal management capability
2Ease of manufacture
If the Zhaga slot dimensions are kept standardized, then mechanical connection and compatibility are ensured, but high-power functionalities such as UVC disinfection and Li-Fi communication cannot be integrated
Solution Approach 1:
The patent utilizes the radial extension dimension beyond the Zhaga standard boundaries to accommodate high-power electronic components and their thermal management requirements, while preserving the standardized insertion interface for manufacturing compatibility
Solution Approach 2:
The patent applies different dimensional constraints to different parts of the module: the insertion interface maintains strict Zhaga standard dimensions for compatibility, while the heat dissipation and high-power component areas extend beyond standard boundaries to provide enhanced functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables higher power functionalities like UVB therapy and UVC disinfection by enhancing heat dissipation, ensuring the module is thermally sound and connectable to Zhaga slots despite non-compliance.
Implementation Method 1
the rim is configured to transfer heat from the electronic component and/or electronics compartment into the ambient
Implementation Method 2
the rim is configured to transfer heat from the electronic component and/or electronics compartment into the ambient
Data Source
AI summary
The invention provides an assembly of a holder device and an electronic module, wherein the holder device comprises an outer surface and a Zhaga slot; wherein the Zhaga slot is recessed in said outer surface and is configured to mechanically connect the electronic module to the holder device; wherein the electronic module comprises: a main body comprising an electronics compartment; an electronic component arranged in said electronics compartment; a rim arranged in thermal communication with the electronic component and/or the electronics compartment; wherein the rim is configured to abut the outer surface of the holder device when the electronic module is mechanically connected to the holder device; wherein the rim is configured to transfer heat from the electronic component and/or electronics compartment into the ambient; wherein the rim extends beyond the standardized boundaries demarcated for a Zhaga module suitable for the Zhaga slot.