Zhaga Sensor Sealing Structure for Humid-Environment Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current Zhaga sensors lack an effective waterproof structure, making them prone to damage in humid environments and rendering them unable to operate properly.
Innovation Solution
A waterproof Zhaga sensor design featuring a housing with a switch hole and waterproof ring, a switch hole sealing pad with multiple sealing rings and a waterproof fixing ring, and an upper cover sealing pad, which collectively form a double-layer or triple-layer waterproof structure to prevent water ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Zhaga sensor is placed in a humid environment without waterproof structure, then the sensor can maintain simple structure and ease of manufacture, but the circuit board is prone to damage due to water contact, rendering the sensor unable to operate properly
Solution Approach 1:
The patent implements a multi-layer nested waterproof structure where the waterproof ring is embedded in the housing, the seal ring is embedded in the waterproof ring, and the insulating sheet with sealing ring is embedded in the seal ring. This nested arrangement creates multiple waterproof barriers without significantly increasing external dimensions, effectively resolving the contradiction between reliability and device complexity.
Solution Approach 2:
The patent applies waterproofing measures specifically at critical locations where water ingress would cause damage. The waterproof ring, seal ring, and insulating sheet with sealing ring are strategically positioned at the switch hole and circuit board interface areas. This localized approach provides effective waterproof protection while maintaining overall structural simplicity, addressing the contradiction between reliability and device complexity.
2Reliability
If a waterproof structure is added to the Zhaga sensor, then the sensor can operate reliably in humid environments, but the manufacturing process becomes more complex
Solution Approach 1:
The waterproof structure is divided into distinct modular components: a waterproof ring integrated into the housing, a separate seal ring, and an insulating sheet with its own sealing ring. Each component can be manufactured independently using standard processes, then assembled together. This segmentation allows for easier manufacturing and quality control while achieving reliable waterproof performance.
Solution Approach 2:
The waterproof ring, seal ring, and insulating sheet are pre-formed as separate components before final assembly. This preliminary preparation of waterproof elements allows for standardized manufacturing processes and simplifies the final assembly operation, reducing overall manufacturing complexity while ensuring reliable waterproof performance.
3Reliability
If multiple sealing components are used to form double-layer or triple-layer waterproof structure, then the waterproof performance is significantly enhanced, but the device complexity increases
Solution Approach 1:
The patent combines multiple waterproofing functions into integrated components. The waterproof ring serves both as a structural element of the housing and as a waterproof barrier. The insulating sheet simultaneously provides electrical insulation and incorporates a sealing ring for waterproofing. This merging of functions reduces the number of separate components needed while achieving enhanced waterproof performance.
Solution Approach 2:
The waterproof ring, seal ring, and insulating sheet each serve multiple functions. The waterproof ring provides both structural support and waterproofing. The insulating sheet provides both electrical insulation and waterproof sealing through its integrated sealing ring. This multi-functionality allows the system to achieve triple-layer waterproof protection without proportionally increasing device complexity.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A waterproof Zhaga sensor (1) having group-controlled function includes a housing (11), an upper cover (12), a first circuit board (13), a group-controlled dip switch (14), a second circuit board (18), a plurality of metal pins (15) and a switch hole sealing pad (16). The housing (11) has an upper opening (H1), a lower opening (H2), and a switch hole (H3). The upper cover (12) is disposed on the upper opening (H1) to cover the upper opening (H1). The first circuit board (13) is disposed inside the housing (11). The group-controlled dip switch (14) is disposed on the first circuit board (13) and corresponding to the switch hole (H3). The second circuit board (18) is disposed on the first circuit board (13). The metal pins (15) are disposed at the lower opening (H2) to form a Zhaga interface and electrically connected to the first circuit board (13). The switch hole sealing pad (16) is disposed on the switch hole (H3) to cover the switch hole (H3).