Zigzag Dielectric Dummy Pattern for Driver Chip Mounting
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Solution Overview
Problem
Existing display devices face challenges in mounting driver chips without causing cracks or fractures in the substrate, particularly due to uneven stress distribution and pressure concentration during the bonding process.
Innovation Solution
Incorporating a dummy pattern with dielectric material between the driver chip and the display panel, arranged in a zigzag fashion to distribute stress uniformly and prevent deformation, and using multiple dielectric layers with aligned lateral surfaces to support the chip and panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a driver chip is mounted directly on the display panel without additional structures, then the device complexity is reduced, but cracks or fractures occur due to uneven stress distribution
Solution Approach 1:
A dummy pattern consisting of dielectric material is introduced as an intermediary structure between the driver chip and the display panel. This dummy pattern includes first dummy members and second dummy members arranged in a zigzag configuration, which acts as a mediator to distribute mounting stress uniformly across the bonding interface, preventing cracks and fractures while maintaining overall structural simplicity
Solution Approach 2:
The dummy pattern is segmented into multiple discrete components: first dummy members and second dummy members arranged alternately in a zigzag pattern. This segmentation allows the stress distribution function to be performed through multiple distributed points rather than a single continuous structure, improving reliability without significantly increasing complexity
2Stability of the object's composition
If multiple dielectric layers are added to support the driver chip, then stress distribution improves, but the device complexity increases
Solution Approach 1:
The dielectric material is applied locally in the form of dummy members positioned specifically in the region between the driver chip and display panel where stress concentration occurs. Rather than adding multiple continuous dielectric layers across the entire device, the solution provides targeted local support only where needed, maintaining stress distribution uniformity while minimizing overall structural complexity
Solution Approach 2:
The dummy pattern uses a zigzag arrangement of discrete dielectric members that provides sufficient stress distribution through partial coverage rather than complete continuous layering. This partial action approach achieves the necessary mechanical support and stress uniformity without the full complexity of multiple complete dielectric layers
3Stability of the object's composition
If the dummy pattern is placed close to the driver chip for better support, then stress distribution improves, but the risk of deformation increases
Solution Approach 1:
The dummy pattern is arranged in a zigzag configuration that extends in both the first direction and second direction, creating a two-dimensional distributed support structure. This dimensional arrangement allows the dummy members to be positioned close to the driver chip for effective stress distribution while the zigzag geometry inherently resists deformation by distributing mechanical loads across multiple directions
Data Source
AI summary
A display device includes a display panel including pixels, first output pads arranged along a first direction, second output pads spaced apart from the first output pads in a second direction, and input pads spaced apart in the second direction from the second output pads and arranged along the first direction; a driver chip including first output bumps arranged along the first direction and coupled to the first output pads, second output bumps spaced apart in the second direction at a first distance from the first output bumps and coupled to the second output pads, and input bumps spaced apart in the second direction from the second output bumps and coupled to the input pads; and a dummy pattern between the second output pads and the input pads and in contact with the display panel and the driver chip. The dummy pattern includes a dielectric material.