Zigzag Inlay Wire Layout for Reliable Electronic Document Contacts
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Solution Overview
Problem
Existing methods for manufacturing electronic documents with embedded metal wires face issues such as poor contact between wire ends and modules, wire tearing during machining, and malfunctions due to loose wire portions, leading to potential short circuits and reduced connectivity.
Innovation Solution
The use of a zigzag metal wire embedded in the substrate, with connecting wires to link rectilinear segments, and a controlled machining angle to form a cavity, ensuring secure wire connections and minimizing tearing risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the machining depth is increased to ensure good contact between wire ends and module, then contact quality improves, but the risk of wire tearing increases
Solution Approach 1:
The wire is pre-formed into a zigzag configuration before machining, with connection portions extending beyond the substrate surface. This preliminary arrangement ensures that when machining occurs, the wire is already positioned to maintain integrity while enabling good contact, eliminating the need to choose between deep machining and wire protection
Solution Approach 2:
The zigzag wire configuration acts as a cushioning mechanism where the detours provide mechanical compliance and stress distribution. The connection portions extending beyond the substrate serve as a buffer zone that absorbs machining stresses, preventing wire tearing while ensuring adequate contact depth
2Reliability
If the machining depth is reduced to prevent wire tearing, then wire integrity is maintained, but contact quality deteriorates
Solution Approach 1:
The wire is arranged in a zigzag pattern with connection portions extending in multiple directions beyond the substrate surface. This dimensional arrangement allows the wire to achieve good contact at shallower machining depths by utilizing the extended connection portions that protrude from the substrate, eliminating the need for deep machining
3Ease of manufacture
If traditional straight wire configuration is used, then manufacturing is simpler, but wire tearing and poor contact occur due to machining tolerances
Solution Approach 1:
The wire is segmented into multiple portions: embedded portions within the substrate and connection portions extending beyond. The zigzag configuration creates distinct segments that can independently accommodate machining variations, with each connection portion serving as a separate contact point that maintains reliability despite tolerances
Solution Approach 2:
The wire configuration changes from a simple straight line to a zigzag pattern with varying angles and extended connection portions. This parameter change in geometry provides mechanical compliance and stress distribution, allowing the wire to accommodate machining tolerances while maintaining both manufacturing feasibility and connectivity reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances reliable electrical contact and resistance to wire tearing, improving the reliability and durability of electronic documents by reducing manufacturing tolerances and ensuring consistent connectivity.
Implementation Method 1
The wire is embedded in the substrate by means of ultrasonic vibrations transmitted to the wire from the tool. The vibrations are transmitted perpendicular to the substrate to embed the wire in the thickness of the substrate.
Implementation Method 2
The wire is, for example, surrounded by an insulating sheath which is heated, for example for a very short time, to improve the adhesion of the sheath to the substrate.
Data Source
Figure 1
Figure 2A~2D
Figure 3~4
AI summary
An inlay (40) comprising a substrate (41) and a first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) comprising alternately straight segments (422) and curves (423), at least one of the straight segments (422) of the first zigzag portion (42) being disposed, at least in part, in an area (45) of the upper face (43) of the substrate (41) configured to form a counterbore in a cavity of an electronic document, and the inlay (40) comprising a connecting wire (47) configured to join together at least the straight segments (422) of the first zigzag portion (42). A method for manufacturing an electronic document (1) comprising such an inlay (40) and an electronic document (1).