Zigzagged Ground Wire Routing for Narrow Bezel Display Impedance
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Solution Overview
Problem
In narrow bezel displays, the narrow ground wires around corners lead to high impedance and weak electrostatic shielding, causing electrostatic damages due to abrupt changes in impedance.
Innovation Solution
The array substrate design includes zigzagged circuitous ground wires with fewer layers closer to the driving chip assembly and symmetrically disposed ground wires with distinct segments, ensuring proper connection and distribution of ground wires to mitigate electrostatic issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If ground wires are narrowed around corners to fit narrow bezel display space, then space utilization is improved, but impedance increases and electrostatic shielding ability deteriorates
Solution Approach 1:
The ground wire is divided into multiple segments including a first segment, a second segment, and a third segment. The first segment is disposed close to an outer side of the first subregion, the second segment connects to the first segment and extends away from the display region, and the third segment connects to the second segment and extends to the driving chip assembly. This segmentation allows the ground wire to navigate around corners while maintaining adequate width and impedance characteristics in each segment.
Solution Approach 2:
The ground wire is configured to extend in multiple directions and layers, transitioning from a simple linear path to a three-dimensional routing structure. The ground wire extends away from the display region in the second region, utilizing the vertical dimension and lateral space to maintain proper impedance while reaching the driving chip assembly, thereby solving the space constraint issue.
2Area of stationary object
If ground wires maintain narrow width after being narrowed around corners, then space is saved, but impedance remains high and electrostatic shielding becomes weak
Solution Approach 1:
Different segments of the ground wire have different routing characteristics optimized for their local requirements. The first segment is disposed close to the outer side of the first subregion with specific width characteristics, the second segment extends away from the display region with controlled impedance, and the third segment connects to the driving chip assembly. This local optimization ensures each segment maintains appropriate electrical properties for its specific function.
3Reliability
If ground wires expand width after being narrowed around corners, then electrostatic shielding improves, but abrupt impedance change occurs at corners
Solution Approach 1:
The ground wire is divided into multiple segments with transition regions between them. The first segment, second segment, and third segment are connected in sequence, with each connection point serving as a gradual transition zone. This segmentation prevents abrupt impedance changes by distributing the width adjustment across multiple controlled transitions rather than a single sharp corner.
Solution Approach 2:
The ground wire uses curved and zigzagged paths instead of sharp angular corners. The ground wire is configured to extend away from the display region in a curved manner in the second region, and the circuitous ground wires zigzagged from an inner side to an outer side in the first subregion. These curved transitions smooth out impedance variations that would occur with sharp angular changes.
Data Source
AI summary
The present application relates to an array substrate including a display region and a non-display region. The non-display region encapsulates the display region. The non-display region includes a first region and a second region. The first region is configured to dispose trances. The second region is configured to dispose a driving chip assembly. The first region includes a first subregion. Ground wires are disposed in the first subregion. A number of layers of an end of the ground wires close to the second region is less than a number of layers of an end of the ground wires away from the second region.