Zinc-Treated Copper-Clad Laminates for High-Heat Blister Resistance
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Solution Overview
Problem
Existing copper-clad laminates for printed wiring boards suffer from blistering issues due to high heat treatments, which affect reliability and yield, and previous solutions restrict design freedom or require inert gas atmospheres, impacting productivity.
Innovation Solution
A copper-clad laminate with a surface-treated copper foil containing a metal-treated layer with zinc, optionally combined with nickel or molybdenum, and a specific zinc content range of 10 to 2,500 μg/dm², is used, along with a thermosetting resin prepreg, to enhance blister resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high heat treatment is applied to improve production efficiency, then productivity increases, but blistering occurs reducing reliability
Solution Approach 1:
The invention changes the chemical composition parameters of the copper foil by controlling zinc content (10-2500 μg/dm²) and the ratio of zinc to other metals (Ni, Co, Mo) in the metal-treated layer. This compositional parameter optimization enables the copper foil to withstand high heat treatment temperatures without blistering, thus resolving the contradiction between improved productivity through high-heat processing and maintained reliability through blister resistance.
Solution Approach 2:
The invention creates a composite metal-treated layer structure on the copper foil surface containing multiple elements (Zn, Ni, Co, Mo) in specific proportions. This composite material structure provides both heat resistance and adhesion properties, allowing the copper-clad laminate to undergo high-temperature processing without blistering, thereby enabling high productivity while maintaining reliability.
2Reliability
If metal wall portion is formed on peripheral edges to suppress moisture entry, then blister resistance improves, but design freedom is restricted
Solution Approach 1:
The invention applies local quality by concentrating the metal treatment specifically on the copper foil surface that contacts the insulating layer, rather than forming metal walls on peripheral edges. The metal-treated layer with optimized Zn/Ni/Co/Mo composition provides localized blister resistance at the critical interface between copper foil and insulating layer, without restricting overall board design freedom.
3Reliability
If epoxy resin is cured in inert gas atmosphere to suppress blisters, then blister resistance improves, but productivity and handling property deteriorate
Solution Approach 1:
The invention extracts the blister suppression function from the curing atmosphere (inert gas) and transfers it to the copper foil surface treatment. By forming a metal-treated layer with specific composition on the copper foil, the invention eliminates the need for inert gas atmosphere during curing, allowing normal atmospheric processing that improves productivity and handling while maintaining blister resistance.
Data Source
AI summary
Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 μg/dm2; a method for producing the copper-clad laminate; and a printed wiring board and a semiconductor package using the copper-clad laminate.