Zircon Refractory Block Composition for High-Temperature Glass Forming
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Solution Overview
Problem
The formation of high strain point alkali-free alumino-silicate glasses for applications like LCD and OLED substrates is challenging due to higher forming temperatures, which lead to increased bubble formation and creep deformation in zircon materials, making current zircon materials unsuitable for ultra-high resolution TFT substrate applications.
Innovation Solution
A zircon body with a composition comprising zircon grains and an Al2O3 rich intergranular phase, where the zircon body includes 2.1-5.5 wt.% Al2O3, 25-35 wt.% SiO2, and a free silica intergranular phase, distributed uniformly, to minimize blistering and creep deformation, thereby improving the mechanical properties at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If higher forming temperature is used for high strain point alkali-free alumino-silicate glasses, then glass processing capability is improved, but bubble formation in zircon material increases
Solution Approach 1:
The patent modifies the chemical composition parameters of the zircon material by adding specific amounts of Al2O3 (2.1-5.5 wt.%) and SiO2 (25-35 wt.%) to change the material's thermal and chemical properties, thereby reducing bubble formation at high temperatures
Solution Approach 2:
The patent creates a composite zircon material system combining ZrSiO4 base material with Al2O3 and SiO2 additives, forming a multi-phase structure that provides both high-temperature stability and resistance to glass-induced bubble formation
2Temperature
If higher forming temperature is used for high strain point alkali-free alumino-silicate glasses, then glass processing capability is improved, but creep deformation of zircon material increases
Solution Approach 1:
The patent changes the compositional parameters of zircon material by incorporating Al2O3 (2.1-5.5 wt.%) and SiO2 (25-35 wt.%) to enhance the material's resistance to creep deformation at elevated temperatures
Solution Approach 2:
The patent develops a composite zircon-based material system where Al2O3 and SiO2 phases work synergistically with the ZrSiO4 matrix to maintain dimensional stability and reduce creep deformation under high-temperature forming conditions
3Stability of the object's composition
If Al2O3 content is increased in zircon material, then creep resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the Al2O3 content parameter within a specific range (2.1-5.5 wt.%) to achieve the necessary creep resistance while avoiding excessive manufacturing complexity that would result from higher concentrations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The zircon body exhibits reduced blistering and creep deformation rates, ensuring the stability and integrity of the glass substrates during high-temperature processing, making it suitable for ultra-high resolution TFT substrate applications.
Implementation Method 1
the higher forming temperature activates the creep deformation rate of the zircon material leading to higher sag of the forming blocks
Implementation Method 2
the higher forming temperature (between + 30 and 120 °C)
Data Source
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AI summary
A refractory object may include a zircon body that may include at least about 0.1 wt.% and not greater than about 5.5 wt.% of an Al2O3 containing component for a total weight of the zircon body. The zircon body may further include at least about 25 wt.% and not greater than about 35 wt.% of a SiO2 component for a total weight of the zircon body.