Zone-Based Soft Post-Package Repair for Memory Fuse Logic
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Solution Overview
Problem
Existing semiconductor memory devices face challenges in managing multiple soft post-package repair (SPPR) operations, as they often cause conflicts by identifying the same redundant row as open in different operations, leading to inefficiencies and complexities in repair logic.
Innovation Solution
The solution involves dividing the fuse array into non-overlapping zones based on the number of SPPR operations, allowing each SPPR operation to search for an open redundant row in a different region, using counters to track the number of operations and determine which zone to search, thereby preventing conflicts and simplifying the logic for managing multiple repairs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple SPPR operations are performed using the same fuse array, then repair operations can be conducted, but conflicts occur when the same redundant row is identified as open in different operations
Solution Approach 1:
The fuse array is divided into multiple non-overlapping zones, with each zone dedicated to a specific SPPR operation. This segmentation prevents conflicts by ensuring that each SPPR operation searches for open redundant rows in its own designated zone, eliminating the need for complex conflict detection and resolution logic.
2Adaptability or versatility
If the entire fuse array is searched for open redundant rows in each SPPR operation, then all available redundant rows can be identified, but the search process becomes inefficient and conflicts arise
Solution Approach 1:
The fuse array is segmented into zones that are searched sequentially or in parallel depending on the number of defective rows. This allows the system to adaptively search only the necessary portions of the fuse array, improving efficiency while maintaining the ability to identify all needed redundant rows.
Solution Approach 2:
The search process is made dynamic by adjusting the number of zones searched based on the number of defective rows detected. When fewer defective rows are found, fewer zones need to be searched, optimizing the repair process efficiency while still ensuring all necessary redundant rows are identified.
Data Source
AI summary
Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.