Zero Temperature Coefficient Capacitor Phosphorus Doping

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Electronic capacitors face challenges in maintaining constant capacitance over a range of temperatures, as existing technologies fail to effectively control temperature coefficients within a desirable range.

Innovation Solution

A zero temperature coefficient (ZTC) capacitor is formed by creating a silicon dioxide dielectric layer and introducing phosphorus with a density between 1.7×10^20 atoms/cm^3 and 2.3×10^20 atoms/cm^3, either through ion implantation or other means, to achieve a temperature coefficient between −1 ppm/°C and 1 ppm/°C, which can be integrated into an integrated circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional capacitor structures are used, then manufacturing is simpler, but temperature coefficient control is poor

Engineering Contradiction:
Improvetemperature coefficient controlVSAvoidcapacitor structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by precisely controlling the phosphorus density parameter within a specific range (1.7×10^20 to 2.3×10^20 atoms/cm³) to achieve the desired temperature coefficient. This involves changing the material composition parameter (phosphorus concentration) to transform the capacitor's thermal characteristics from conventional poor control to zero temperature coefficient performance.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining silicon dioxide with phosphorus doping to create a new dielectric material with superior temperature stability. The phosphorus-doped silicon dioxide composite achieves a temperature coefficient between -1 ppm/°C and 1 ppm/°C, which is significantly better than conventional undoped silicon dioxide capacitors.

Inventive Principle:
Principle #40Composite materials

2Stability of the object's composition

If phosphorus density is increased to reduce temperature coefficient, then temperature stability improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvecapacitance stabilityVSAvoidphosphorus density control
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The patent defines a specific parameter range for phosphorus density (1.7×10^20 to 2.3×10^20 atoms/cm³) that balances temperature stability with manufacturing feasibility. By establishing this optimal parameter window, the patent reduces the precision burden compared to requiring an extremely narrow or extreme parameter value, while still achieving the target temperature coefficient of -1 to 1 ppm/°C.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ZTC capacitor maintains consistent capacitance across varying temperatures, ensuring reliable performance in temperature-sensitive applications by achieving a negligible temperature coefficient, thereby addressing the issue of capacitance variation.

Implementation Method 1

The phosphorus may be ion implanted, provided from a diffusion source, or provided by other means

Methodology Applied
Scientific EffectIon implantation: Ion Implantation

Implementation Method 2

The phosphorus may be ion implanted, provided from a diffusion source, or provided by other means

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS8373215B2Zero temperature coefficient capacitor
Publication Date: 2013.02.12 TEXAS INSTRUMENTS INC
  • US8373215B2 patent drawing
  • US8373215B2 patent drawing
  • US8373215B2 patent drawing

AI summary

A zero temperature coefficient (ZTC) capacitor including a silicon dioxide dielectric layer with a phosphorus density between 1.7×1020 atoms/cm3 and 2.3×1020 atoms/cm3. An integrated circuit containing a ZTC capacitor including a silicon dioxide dielectric layer with a phosphorus density between 1.7×1020 atoms/cm3 and 2.3×1020 atoms/cm3. A process of forming an integrated circuit containing a ZTC capacitor including a silicon dioxide dielectric layer with a phosphorus density between 1.7×1020 atoms/cm3 and 2.3×1020 atoms/cm3.