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Home»TRIZ Case»Efficient Heat Transfer Device for Cooling Electronics

Efficient Heat Transfer Device for Cooling Electronics

May 22, 20263 Mins Read
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Efficient Heat Transfer Device for Cooling Electronics

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Summary

Problems

Existing heat transfer devices face challenges in efficiently managing waste heat in electronic devices and components that experience transient heat dissipation bursts, particularly in varying environmental conditions, and require reliable thermal control systems that can handle long periods of inactivity.

Innovation solutions

A heat transfer device with a storage chamber, coolant, cooling chamber, and a barrier element that transitions from a closed to an open configuration in response to temperature or pressure triggers, allowing coolant to flow and facilitate heat transfer from a heat source to the cooling chamber.

TRIZ Analysis

Specific contradictions:

storage reliability
vs
heat dissipation response speed

General conflict description:

Reliability
vs
Speed
TRIZ inspiration library
10 Preliminary action
Try to solve problems with it

Principle concept:

If a barrier element restricts coolant flow during storage, then the device can be stored in various environmental conditions, but the device cannot respond quickly to transient heat dissipation bursts

Why choose this principle:

The coolant is pre-positioned in the storage chamber and the barrier element is pre-configured to seal the fluid passage during storage. When heat dissipation is needed, the barrier element automatically opens to allow immediate coolant flow, eliminating the need for pump activation or complex control systems.

TRIZ inspiration library
25 Self-service
Try to solve problems with it

Principle concept:

If a barrier element restricts coolant flow during storage, then the device can be stored in various environmental conditions, but the device cannot respond quickly to transient heat dissipation bursts

Why choose this principle:

The system uses the pressure differential created by heating to automatically open the barrier element and drive coolant flow through the heat transfer components, eliminating the need for external power sources or control mechanisms.

Application Domain

heat transfer cooling electronics thermal management

Data Source

Patent US11378340B2 Heat transfer devices and methods of cooling heat sources
Publication Date: 05 Jul 2022 TRIZ 电器元件
FIG 01
US11378340-D00001
FIG 02
US11378340-D00002
FIG 03
US11378340-D00003
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AI summary:

A heat transfer device with a storage chamber, coolant, cooling chamber, and a barrier element that transitions from a closed to an open configuration in response to temperature or pressure triggers, allowing coolant to flow and facilitate heat transfer from a heat source to the cooling chamber.

Abstract

A heat transfer device includes a storage chamber, a coolant housed within the storage chamber, a cooling chamber, one or more heat transfer components, a fluid passage between the storage chamber and the cooling chamber, and a barrier element. The one or more heat transfer components facilitate heat transfer from a heat source outside of the cooling chamber to the cooling chamber. The barrier element may have (i) a closed configuration, and (ii) an open configuration in which the barrier element is configured to allow the coolant in the storage chamber to flow from the storage chamber into the cooling chamber. The barrier element may reconfigure from the closed configuration to the open configuration in response to a trigger condition, such as the coolant housed within the storage chamber reaching a trigger temperature and/or the initial pressure of the coolant housed within the storage chamber reaching a trigger pressure.

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    cooling electronics heat transfer Thermal Management
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    Table of Contents
    • Efficient Heat Transfer Device for Cooling Electronics
      • Summary
      • TRIZ Analysis
      • Data Source
      • Accelerate from idea to impact
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