Improved Electrode Layers on Softening Polymers for Flexible Devices
Here’s PatSnap Eureka !
Summary
Problems
Conventional methods for forming electrode layers on softening polymers in flexible electrical devices often result in residual organic material, leading to reduced sensitivity and potential delamination, and existing clean-up procedures can be lengthy and ineffective, while also affecting the surface roughness and charge injection capacity of the electrodes.
Innovation solutions
A liftoff process using an inorganic liftoff layer with a thin film stress of less than 150 MPa, combined with a horizontal liftoff etch and reactive ion etch processes, to pattern and deposit electrode layers on softening polymers, minimizing residual organic material and maintaining device integrity.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If conventional methods are used to form electrode layers on softening polymers, then electrode layers can be formed, but residual organic material remains leading to reduced sensitivity and potential delamination
Why choose this principle:
The patent extracts and removes residual organic material from the electrode layer surface through a systematic clean-up process involving oxygen plasma treatment and chemical etching. This extraction principle directly addresses the harmful residual organic material while preserving the electrode layer structure and adhesion to the softening polymer substrate.
Principle concept:
If conventional methods are used to form electrode layers on softening polymers, then electrode layers can be formed, but residual organic material remains leading to reduced sensitivity and potential delamination
Why choose this principle:
The patent replaces mechanical cleaning methods with chemical and plasma-based cleaning processes. Instead of physical abrasion or scraping that could damage the electrode or polymer, the invention uses oxygen plasma and chemical etchants to selectively remove organic residues, thereby improving sensitivity and preventing delamination without mechanical damage.
Application Domain
Data Source
AI summary:
A liftoff process using an inorganic liftoff layer with a thin film stress of less than 150 MPa, combined with a horizontal liftoff etch and reactive ion etch processes, to pattern and deposit electrode layers on softening polymers, minimizing residual organic material and maintaining device integrity.
Abstract
Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.