Magnetic Shielding in Semiconductor Devices: Adhesive-Free Design
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Summary
Problems
Existing semiconductor devices face challenges in effectively protecting against magnetic and electromagnetic noise due to the limitations of adhesive agents used in magnetic shielding, which reduce magnetic permeability and complicate manufacturing processes.
Innovation solutions
The use of magnetic and conductive shield members connected via wires or sheets without adhesive agents, forming a shield structure that maintains high magnetic or electrical conductivity and simplifies the manufacturing process by eliminating the need for adhesives.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If adhesive agent is used to bond holding plate and lid plate, then the magnetic member can be assembled, but the magnetic permeability is lowered and an additional step is required
Why choose this principle:
The invention extracts and removes the adhesive agent from the magnetic member assembly. By bonding the holding plate and lid plate directly without adhesive, the magnetic member maintains high magnetic permeability throughout, eliminating the non-magnetic adhesive layer that would otherwise interrupt magnetic flux paths.
Principle concept:
If adhesive agent is used to bond holding plate and lid plate, then the magnetic member can be assembled, but the magnetic permeability is lowered and an additional step is required
Why choose this principle:
The invention merges the holding plate and lid plate into a unified magnetic member structure through direct bonding. This integration ensures continuous magnetic permeability across the entire assembly, allowing magnetic flux to flow uniformly without encountering non-magnetic adhesive barriers.
Application Domain
Data Source
AI summary:
The use of magnetic and conductive shield members connected via wires or sheets without adhesive agents, forming a shield structure that maintains high magnetic or electrical conductivity and simplifies the manufacturing process by eliminating the need for adhesives.
Abstract
In one embodiment, a semiconductor device includes a substrate, and a first shield member provided on or in the substrate. The device further includes a semiconductor chip provided on the first shield member, and a first wire electrically connected to the semiconductor chip and the substrate. The device further includes a second wire electrically or magnetically connected to the first shield member, and a second shield member provided above the semiconductor chip, electrically insulated from the first wire, and electrically or magnetically connected to the second wire.