Embedded Heat Dissipation for Reliable 3DICs
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Summary
Problems
Three-dimensional integrated circuits (3DICs) face heat dissipation challenges, particularly with the bottom die experiencing high thermal resistance and excessive temperature rise due to heat generated by stacked components, which can reduce reliability and operating lifetime, especially in high-power components like CPUs.
Innovation solutions
The integration of an embedded heat dissipation feature (eHDF) within the package structure, utilizing high thermal conductivity materials and adhesives, provides additional heat dissipation pathways from the chips to the substrate and a heat sink, bypassing the top die, thereby improving thermal management.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a heat sink is mounted on the top die for heat dissipation, then the top die experiences good heat-dissipating condition, but the bottom die suffers from heat-dissipation problem due to high thermal resistance of the top die
Why choose this principle:
The patent transitions from single-point top-side cooling to a distributed three-dimensional cooling architecture. Multiple heat dissipation pathways are created by embedding heat dissipation features at different vertical levels (between dies and at substrate level), transforming the cooling approach from two-dimensional surface cooling to three-dimensional volumetric cooling that addresses heat sources throughout the stack.
Principle concept:
If a heat sink is mounted on the top die for heat dissipation, then the top die experiences good heat-dissipating condition, but the bottom die suffers from heat-dissipation problem due to high thermal resistance of the top die
Why choose this principle:
The heat dissipation function is segmented into multiple independent heat dissipation features distributed throughout the 3DIC stack. Instead of relying on a single heat sink at the top, the patent divides the thermal management system into multiple segments: heat dissipation features embedded between individual dies and additional features at the substrate level, allowing each segment to independently manage heat from specific dies.
Application Domain
Data Source
AI summary:
The integration of an embedded heat dissipation feature (eHDF) within the package structure, utilizing high thermal conductivity materials and adhesives, provides additional heat dissipation pathways from the chips to the substrate and a heat sink, bypassing the top die, thereby improving thermal management.
Abstract
An integrated circuit package and a method of fabrication of the same are provided. An opening is formed in a substrate. An embedded heat dissipation feature (eHDF) is placed in the opening in the substrate and is attached to the substrate using a high thermal conductivity adhesive. One or more bonded chips are attached to the substrate using a flip-chip method. The eHDF is thermally attached to one or more hot spots of the bonded chips. In some embodiments, the eHDF may comprise multiple physically disconnected portions. In other embodiments, the eHDF may have a perforated structure.