Eutectic Bonding for Reliable MEMS Sealing
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Summary
Problems
In micro electro mechanical system (MEMS) package systems, insufficient thermal budget during bonding can result in incomplete sealing of MEMS devices, leading to malfunction, while excessive thermal budget can cause issues like metal melting and short circuits in CMOS transistors.
Innovation solutions
The use of multiple, narrow bond pad rings with recesses on both the device and handle substrates, which require a lower thermal budget for eutectic bonding, reducing the risk of metal melting and ensuring complete sealing of MEMS devices without damaging CMOS components.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a single wide bond pad ring is used for eutectic bonding, then complete sealing of MEMS devices can be achieved, but excessive thermal budget is required causing metal melting and short circuits in CMOS transistors
Why choose this principle:
The single wide bond pad ring is divided into multiple narrow bond pad rings. This segmentation reduces the thermal budget required for each individual ring while collectively achieving complete sealing of the MEMS device, thereby preventing thermal damage to CMOS transistors.
Principle concept:
If a single wide bond pad ring is used for eutectic bonding, then complete sealing of MEMS devices can be achieved, but excessive thermal budget is required causing metal melting and short circuits in CMOS transistors
Why choose this principle:
Different regions of the bonding structure are given different properties through the use of multiple narrow rings with recesses. This allows localized control of thermal exposure, ensuring adequate sealing in critical areas while minimizing thermal impact on CMOS components.
Application Domain
Data Source
AI summary:
The use of multiple, narrow bond pad rings with recesses on both the device and handle substrates, which require a lower thermal budget for eutectic bonding, reducing the risk of metal melting and ensuring complete sealing of MEMS devices without damaging CMOS components.
Abstract
A method of fabricating a micro electro mechanical system (MEMS) structure includes providing a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is provided and bonded with the bonding pad structure of the first substrate structure.