Floating PCB Design to Prevent Connector Stress
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Summary
Problems
In substrate processing systems, the mechanical resistance and stress on connectors between printed circuit boards (PCBs) due to thermal expansion and contraction cause connector failure, leading to high assembly costs and design inflexibility.
Innovation solutions
A mounting system that allows the first PCB to float relative to the electrostatic chuck, using shoulder screws and spacers to absorb thermal expansion and contraction, preventing displacement transfer to the PCBs and ensuring stable connector engagement.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the baseplate is rigidly fixed to the PCB, then structural stability is improved, but thermal expansion stress transfers to the PCB causing connector failure
Why choose this principle:
The mounting system is divided into separate functional components: spacers that provide thermal isolation, shoulder screws that provide mechanical attachment, and floating mounting holes that allow baseplate movement. This segmentation prevents stress transfer while maintaining both structural stability and connector reliability.
Principle concept:
If the baseplate is rigidly fixed to the PCB, then structural stability is improved, but thermal expansion stress transfers to the PCB causing connector failure
Why choose this principle:
The spacers act as intermediary elements between the baseplate and PCB, providing thermal isolation and mechanical support. The floating mounting holes serve as intermediaries that allow the baseplate to expand and contract without transferring stress to the PCB, thus protecting connectors from thermal expansion stress.
Application Domain
Data Source
AI summary:
A mounting system that allows the first PCB to float relative to the electrostatic chuck, using shoulder screws and spacers to absorb thermal expansion and contraction, preventing displacement transfer to the PCBs and ensuring stable connector engagement.
Abstract
A substrate support assembly includes a baseplate to support at least one layer to be disposed thereon and a first printed circuit board coupled to the baseplate by a plurality of mounting assemblies that allow the baseplate to move relative to the first printed circuit board.