Efficient Functional Layer Patterning with Sacrificial Layers
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Summary
Problems
The complexity and cost of manufacturing micro- and nano-electronic devices, particularly MIM type capacitances, are increased due to the multiplication and complexity of photolithography and etching processes, leading to inefficiencies and misalignment of material layers.
Innovation solutions
A method using a sacrificial layer made of lithiated materials like lithium oxide or lithium oxynitride, which inhibits the growth of functional layers, allowing selective deposition and structuring through atomic layer deposition and plasma etching, reducing the number of manufacturing steps.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If photolithography and etching processes are used to structure material layers, then manufacturing precision can be achieved, but device complexity and manufacturing cost increase due to multiple exposure and self-aligned multi-structuring steps
Why choose this principle:
The patent extracts the structuring function from complex photolithography-etching sequences and concentrates it into a single atomic layer deposition step using a sacrificial layer. The sacrificial layer is deposited once, then selectively removed to create the desired pattern, eliminating the need for multiple lithography exposures and etching steps while maintaining alignment precision.
Principle concept:
If photolithography and etching processes are used to structure material layers, then manufacturing precision can be achieved, but device complexity and manufacturing cost increase due to multiple exposure and self-aligned multi-structuring steps
Why choose this principle:
The sacrificial layer is deposited in advance before the functional layers. This preliminary action defines the future structure pattern, allowing subsequent functional layers to be deposited conformally without requiring complex in-situ patterning steps. The sacrificial layer serves as a pre-established template that guides the entire manufacturing process.
Application Domain
Data Source
AI summary:
A method using a sacrificial layer made of lithiated materials like lithium oxide or lithium oxynitride, which inhibits the growth of functional layers, allowing selective deposition and structuring through atomic layer deposition and plasma etching, reducing the number of manufacturing steps.
Abstract
The invention relates, firstly, to a method for structuring a functional layer (130), comprising at least the following steps: a) providing a substrate (110) having a surface locally covered by a so-called sacrificial layer (120), one or more areas of the surface of the substrate (110) being devoid of the sacrificial layer (120); b) selectively growing the functional layer (130) on the area(s) of the surface of the substrate (110) devoid of the sacrificial layer (120); c) removing the sacrificial layer (120); thereby the surface of the substrate (110) is covered by a structured functional layer (130). The invention further relates to a method for preparing a MIM-type capacitance, by implementing the structuring method to structure at least one layer of the capacitance.Applications: micro- and nano-electronic devices such as electronic chips, manufacturing of high-density MIM-type capacitances.