High-Speed Photocurable Composition for Fine Pattern Formation
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Summary
Problems
Viscous photocurable compositions slow down the filling and spreading of fine relief patterns in photo-nanoimprinting, leading to low productivity in forming cured product patterns, and require improved dry etching resistance for high-yield processing in semiconductor and MEMS manufacturing.
Innovation solutions
A photocurable composition with a polymerizable compound and a non-polymerizable component having a specific molecular weight and atom ratio, optimized to achieve high filling speed and dry etching resistance, comprising a (meth)acrylic compound as the main constituent, a photopolymerization initiator, and a non-polymerizable component with low Ohnishi parameters, satisfying specific relational expressions to enhance dry etching resistance without increasing viscosity.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the photocurable composition has high viscosity, then the dry etching resistance is improved, but the filling speed becomes slow
Why choose this principle:
The patent applies parameter changes by carefully controlling the molecular weight and chemical structure of the polymerizable compound to achieve an optimal balance between viscosity and dry etching resistance. By adjusting the parameter OA (defined as NA/(NC,A-NO,A) where NA is total atoms, NC,A is carbon atoms, and NO,A is oxygen atoms) to satisfy OA-OM>1.00, the composition achieves both adequate flowability for fast filling and sufficient dry etching resistance.
Principle concept:
If the photocurable composition has high viscosity, then the dry etching resistance is improved, but the filling speed becomes slow
Why choose this principle:
The patent uses composite materials by formulating a photocurable composition containing multiple components: a polymerizable compound (A) with specific structural parameters, a photopolymerization initiator (B), and other additives in controlled proportions. This composite formulation allows the composition to exhibit both low viscosity for fast filling and high dry etching resistance simultaneously, resolving the contradiction between these two properties.
Application Domain
Data Source
AI summary:
A photocurable composition with a polymerizable compound and a non-polymerizable component having a specific molecular weight and atom ratio, optimized to achieve high filling speed and dry etching resistance, comprising a (meth)acrylic compound as the main constituent, a photopolymerization initiator, and a non-polymerizable component with low Ohnishi parameters, satisfying specific relational expressions to enhance dry etching resistance without increasing viscosity.
Abstract
A photocurable composition contains a polymerizable compound (A) satisfying O A =N A /(N C,A −N O,A ), wherein N A , N C,A and N O,A represent the total number of atoms, the number of carbon atoms, and the number of oxygen atoms, respectively, in (A); and a non-polymerizable component (E) containing at least one compound (X) including a photopolymerization initiator (B), in a proportion of 10% to 50% relative to the total weight of (A) and (E). The component (E) has a weight average molecular weight of 250 or less. The compound (X) satisfies O X =N X /(N C,X −N O,X ). N X , N C,X and N O,X represent the total number of atoms, the number of carbon atoms, and the number of oxygen atoms, respectively, in the corresponding compound (X). The composition satisfies: O A −O E >1.00; and O AE <3.40. O E and O AE represent the molar fraction weighted averages of O X 's and of O A and O E , respectively.