Ionic Wind Cooling for Compact Electronic Devices
Here’s PatSnap Eureka !
Summary
Problems
Miniaturization of electronic devices with heat dissipation functions is challenging due to the difficulty in integrating high-performance heat dissipation means, such as heat dissipation fans, in narrow spaces with high thermal resistance, as seen in communication modules within vehicles, where traditional ionic wind generators do not provide sufficient air volume for effective cooling.
Innovation solutions
An electronic device design incorporating a heat dissipation bridge that protrudes towards a heating element and is connected to a thin flat plate heat sink, utilizing ionic wind for convective heat transfer and heat conduction, enhancing cooling efficiency without the need for separate cooling fans or thick heat sinks, and allowing for modular installation to maintain compatibility with conventional designs.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a heat dissipation fan is installed to improve cooling performance, then heat dissipation performance is improved, but the device size increases and it cannot be installed in narrow spaces
Why choose this principle:
The patent replaces the mechanical heat dissipation fan system with an ionic wind generation system that uses electrical fields to move air molecules. This substitution eliminates the need for mechanical rotating parts while achieving effective heat dissipation in narrow spaces, directly resolving the contradiction between cooling performance and device size.
Principle concept:
If a heat dissipation fan is installed to improve cooling performance, then heat dissipation performance is improved, but the device size increases and it cannot be installed in narrow spaces
Why choose this principle:
The patent changes the operating parameters by using high voltage direct current to generate ionic wind, transforming the heat dissipation mechanism from mechanical to electrohydrodynamic. This parameter change enables compact heat dissipation without requiring large fan components.
Application Domain
Data Source
AI summary:
An electronic device design incorporating a heat dissipation bridge that protrudes towards a heating element and is connected to a thin flat plate heat sink, utilizing ionic wind for convective heat transfer and heat conduction, enhancing cooling efficiency without the need for separate cooling fans or thick heat sinks, and allowing for modular installation to maintain compatibility with conventional designs.
Abstract
An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.