Laser Welding for High-Density Electronic Components
Here’s PatSnap Eureka !
Summary
Problems
Conventional techniques for bonding electrode films and leads in electronic components on ultrathin insulating substrates fail to adequately address thermal responsiveness, size reduction, tensile strength, and heat resistance, often causing thermal damage to the substrate and requiring complex processes for high-density mounting.
Innovation solutions
An electronic component configuration featuring a high melting point active layer, a barrier layer, and a low melting point bonding layer, with a bonding electrode part thickness of 1 μm or less, allowing for efficient tensile strength and heat resistance improvements without substrate damage, and enabling high-density, reliable mounting through laser welding.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If soldering is used for bonding leads to electrode films, then bonding is achieved, but operating temperature is limited to 150°C or less and thickness cannot be reduced
Why choose this principle:
The patent changes the bonding method from soldering to laser welding, fundamentally altering the bonding parameters. Laser welding enables operation at temperatures exceeding 150°C and achieves bonding thickness of 1 μm or less, simultaneously resolving both the temperature limitation and thickness reduction requirements.
Principle concept:
If conductive paste is used for bonding, then bonding is achieved, but tensile strength is insufficient and glass sealing reinforcement is required
Why choose this principle:
The patent replaces the mechanical bonding method (conductive paste with glass sealing) with laser welding. This substitution achieves high tensile strength through direct metal-to-metal bonding without requiring additional glass sealing reinforcement, thereby reducing structural complexity while improving strength.
Application Domain
Data Source
AI summary:
An electronic component configuration featuring a high melting point active layer, a barrier layer, and a low melting point bonding layer, with a bonding electrode part thickness of 1 μm or less, allowing for efficient tensile strength and heat resistance improvements without substrate damage, and enabling high-density, reliable mounting through laser welding.
Abstract
The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.