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Home»TRIZ Case»Linear Scale Design for Thermal Stress Absorption

Linear Scale Design for Thermal Stress Absorption

May 22, 20263 Mins Read
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Linear Scale Design for Thermal Stress Absorption

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Summary

Problems

Existing linear scales face high manufacturing costs and inefficiencies due to the cutting process required for plate spring mechanisms, which leads to reduced precision in thermal stress absorption and increased manufacturing time.

Innovation solutions

The use of rear-face and front-face bushings with elastic members and flanges, which absorb thermal stress without inhibiting expansion/contraction, allowing for easy insertion and reducing the need for cutting processes, while providing stable attachment holes for fixing the scale frame to the measurement target part.

TRIZ Analysis

Specific contradictions:

thermal stress absorption
vs
manufacturing process complexity

General conflict description:

Reliability
vs
Device complexity
TRIZ inspiration library
2 Taking out (Extraction)
Try to solve problems with it

Principle concept:

If plate spring mechanisms are used to absorb bending and parallel plate spring mechanisms are used to absorb expansion/contraction, then thermal stress absorption is improved, but manufacturing complexity and cost increase due to cutting processes

Why choose this principle:

The patent extracts the thermal stress absorption function from complex plate spring mechanisms and implements it through simple bushings with elastic members. The bushings are inserted into attachment holes without requiring cutting processes, thereby maintaining thermal stress absorption capability while dramatically simplifying the manufacturing process.

TRIZ inspiration library
27 Cheap short-living objects (Disposable)
Try to solve problems with it

Principle concept:

If plate spring mechanisms are used to absorb bending and parallel plate spring mechanisms are used to absorb expansion/contraction, then thermal stress absorption is improved, but manufacturing complexity and cost increase due to cutting processes

Why choose this principle:

The patent replaces expensive, time-consuming cutting processes with simple bushing insertion. The bushings are inexpensive components that can be easily manufactured and installed, eliminating the need for complex machining operations while maintaining the required thermal stress absorption function.

Application Domain

linear scale thermal stress absorption manufacturing efficiency

Data Source

Patent US10648833B2 Linear scale
Publication Date: 12 May 2020 TRIZ 机械制造
FIG 01
US10648833-D00001
FIG 02
US10648833-D00002
FIG 03
US10648833-D00003
Login to view Image

AI summary:

The use of rear-face and front-face bushings with elastic members and flanges, which absorb thermal stress without inhibiting expansion/contraction, allowing for easy insertion and reducing the need for cutting processes, while providing stable attachment holes for fixing the scale frame to the measurement target part.

Abstract

A measurement device includes: attachment holes, provided on a scale frame with respect to a measurement direction; rear-face bushings inserted into the attachment holes from a rear face side of the scale frame; and fasteners that fix the scale frame to first measurement target part. Each of the rear-face bushings includes: a cylinder part, which is formed shorter than the length of the attachment holes with respect to a penetration direction and is formed having an outer diameter smaller than the inner diameter of the attachment holes; a flange, which is formed at the end of the cylinder part located toward the first measurement target part and which has an outer diameter greater than the inner diameter of the attachment holes; and an elastic member, which is cylindrical in shape and is provided covering the outer circumferential surface of the cylinder part.

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    linear scale manufacturing efficiency thermal stress absorption
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    Table of Contents
    • Linear Scale Design for Thermal Stress Absorption
      • Summary
      • TRIZ Analysis
      • Data Source
      • Accelerate from idea to impact
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