Nanowire-Based Cooling Module for Semiconductor Heat Dissipation
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Summary
Problems
Existing air cooling technologies struggle to meet the increasing heat dissipation requirements of high-performance computing and high-speed transmission semiconductor package structures, and liquid cooling systems face challenges with sealing design to prevent leakage and electrical short circuits.
Innovation solutions
A cooling module for heterogeneous integrated semiconductor package structures that uses a cooling plate bonded to the package structure and circuit board using nanowires, which also forms a sealed interface for fluid circulation, enhancing heat dissipation and preventing leakage.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If air cooling technology is used, then the cooling system is simple, but it cannot meet the increasing heat dissipation requirements of high-performance computing and high-speed transmission semiconductor package structures
Why choose this principle:
The patent transitions from air cooling to liquid cooling by introducing a liquid cooling system with cooling liquid circulation. The liquid cooling plate contacts the semiconductor package structure, and cooling liquid flows through channels to efficiently dissipate high heat densities that air cooling cannot handle.
Principle concept:
If liquid cooling technology is used, then heat dissipation performance is improved, but sealing design becomes crucial to prevent leakage and electrical short circuits
Why choose this principle:
The patent employs a composite bonding structure using nanowires (such as copper nanowires) combined with traditional bonding methods. The nanowire layer is placed between the cooling plate and the semiconductor package structure, providing both mechanical bonding and electrical insulation, thereby preventing leakage and short circuits while maintaining sealing integrity.
Application Domain
Data Source
AI summary:
A cooling module for heterogeneous integrated semiconductor package structures that uses a cooling plate bonded to the package structure and circuit board using nanowires, which also forms a sealed interface for fluid circulation, enhancing heat dissipation and preventing leakage.
Abstract
A cooling module (2) for a heterogeneous integrated semiconductor package structure (I) is disclosed. The heterogeneous integrated semiconductor package structure (I) is arranged on a circuit board (B). The cooling module (2) includes a cooling plate (P) and a plurality of nanowires (nw). The nanowires (nw) may be configured to be bonded to the cooling plate (P), or may be configured to bond the cooling plate (P) to the heterogeneous integrated semiconductor package structure (I), or may be configured to bond the cooling plate (P) to the circuit board (B), or may be configured to bond the cooling plate (P) to both the heterogeneous integrated semiconductor package structure (I) and the circuit board (B).