Optimized PCB Assembly for High-Density Electronics
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Summary
Problems
Current electronic assembly technologies face challenges in achieving fine resolution interconnects on large panel sizes, requiring intermediate package substrates and leading to increased costs, space, and performance limitations. Additionally, the 'known good die' problem results in defective components, and chiplet assemblies are costly due to the need for silicon interposers.
Innovation solutions
The development of a printed circuit board assembly (PCBA) using flip chip assembly methods on a substrate, allowing for a variety of assembly options to ensure components have a preferred height, and the use of a planarizing filler to optimize cooling performance. This approach eliminates the need for intermediate substrates and reduces costs by integrating components directly onto the PCBA.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If intermediate package substrates are used to achieve fine resolution interconnects, then manufacturing precision is improved, but device complexity and cost increase
Why choose this principle:
The patent extracts and eliminates the intermediate package substrate from the electronic assembly architecture. By directly mounting components onto the final circuit board using advanced flip chip techniques, the intermediate substrate layer is removed entirely, simplifying the overall device structure while maintaining fine resolution interconnect capabilities through direct component-to-board connections
Principle concept:
If intermediate package substrates are used to achieve fine resolution interconnects, then manufacturing precision is improved, but device complexity and cost increase
Why choose this principle:
The patent transitions from planar two-dimensional component layouts to three-dimensional vertical stacking architectures. By utilizing vertical space for multi-layer component stacking and three-dimensional interconnect structures, the system achieves fine resolution interconnectivity without requiring additional intermediate substrate layers, thereby reducing device complexity while maintaining manufacturing precision
Application Domain
Data Source
AI summary:
The development of a printed circuit board assembly (PCBA) using flip chip assembly methods on a substrate, allowing for a variety of assembly options to ensure components have a preferred height, and the use of a planarizing filler to optimize cooling performance. This approach eliminates the need for intermediate substrates and reduces costs by integrating components directly onto the PCBA.
Abstract
A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.