Porous Substrate Design for Micro-LED Assembly Precision
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Summary
Problems
Large micro-LED displays face challenges in quickly and accurately transferring millions of micro-LEDs to the display panel due to substrate warping caused by gravity, leading to non-uniform assembly rates and potential adsorption of micro-LEDs to incorrect locations.
Innovation solutions
A substrate structure with a partition wall having a porous structure is used, where the density and size of pores vary depending on the height from the substrate to control substrate shrinkage and prevent warping, ensuring uniform assembly rates and proper placement of micro-LEDs.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If self-assembly method is used for large micro-LED displays, then assembly automation is improved, but substrate warping occurs due to gravity causing non-uniform assembly rates
Why choose this principle:
The partition wall is designed with a porous structure containing multiple pores, which enables the wall to shrink when exposed to moisture from the aqueous solution. This shrinkage generates a counteracting force against gravitational warping, maintaining substrate flatness and ensuring uniform assembly rates across the large-area substrate during automated self-assembly
Principle concept:
If self-assembly method is used for large micro-LED displays, then assembly automation is improved, but substrate warping occurs due to gravity causing non-uniform assembly rates
Why choose this principle:
The partition wall's physical properties are changed by controlling pore density and size distribution. By adjusting these parameters, the wall's shrinkage characteristics are optimized to counteract gravity-induced warping, enabling the substrate to maintain flatness throughout the automated assembly process
Application Domain
Data Source
AI summary:
A substrate structure with a partition wall having a porous structure is used, where the density and size of pores vary depending on the height from the substrate to control substrate shrinkage and prevent warping, ensuring uniform assembly rates and proper placement of micro-LEDs.
Abstract
The substrate structure for transferring the pixel semiconductor light emitting device according to the embodiment may include a substrate having a plurality of assembly wiring; a partition wall disposed on the substrate and having an assembly hole into which a predetermined semiconductor light emitting device is assembled; and the partition wall may include a porous structure.