Enhanced Power Module Design for Improved Heat Dissipation
Here’s PatSnap Eureka !
Summary
Problems
Existing power modules face structural constraints due to patterns, wire bonding, and spacers, which limit their ability to improve electric power performance and cooling efficiency.
Innovation solutions
The power module incorporates a third substrate with a conductive pattern to define signal connections, eliminates substrate patterns and wire bonding, and uses leads to connect substrates, thereby enhancing heat dissipation and electric power performance.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If patterns, wire bonding, and spacers are used in the power module, then signal connection and structural support are achieved, but heat dissipation area is reduced and current paths are lengthened
Why choose this principle:
The patent removes traditional patterns, wire bonding, and spacers from the power module structure. By extracting these components that occupy space and create structural constraints, the invention increases the available heat dissipation area and shortens current paths, thereby improving electric power performance without compromising signal connection functionality
Principle concept:
If patterns, wire bonding, and spacers are used in the power module, then signal connection and structural support are achieved, but heat dissipation area is reduced and current paths are lengthened
Why choose this principle:
The invention transitions from planar patterns on substrates to three-dimensional lead structures that extend vertically between substrates. This dimensional change allows current to flow through shorter vertical paths via leads rather than traversing long horizontal paths through patterns and wire bonds, reducing parasitic inductance and improving electrical performance
Application Domain
Data Source
AI summary:
The power module incorporates a third substrate with a conductive pattern to define signal connections, eliminates substrate patterns and wire bonding, and uses leads to connect substrates, thereby enhancing heat dissipation and electric power performance.
Abstract
A power module includes first and second substrates spaced from each other, at least one semiconductor chip, and at least one third substrate, in which the at least one third substrate includes at least one conductive pattern including one end portion electrically connected to any one of the semiconductor chips, and the other end portion extending outwardly from the first and second substrates.