Efficient Cooling Design for Semiconductor Modules
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Summary
Problems
Conventional semiconductor modules have low cooling efficiency due to heat generation by capacitors, which is not effectively dissipated, leading to thermal interference and reduced performance.
Innovation solutions
The semiconductor module incorporates a cooling device with a refrigerant circulation system and strategically arranged metal bodies and circuit substrates to efficiently transfer heat from semiconductor chips and capacitors to cooling fins, enhancing thermal management.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a capacitor is connected to the input terminal of the semiconductor module, then the electrical function is improved, but heat generation increases and cooling efficiency decreases
Why choose this principle:
The patent segments the heat dissipation system by providing separate cooling paths: one for the semiconductor element (through the semiconductor element cooling plate) and another for the capacitor (through the capacitor cooling plate). This segmentation allows each component to be cooled optimally according to its specific thermal characteristics, resolving the contradiction between maintaining electrical function and managing heat generation.
Principle concept:
If a capacitor is connected to the input terminal of the semiconductor module, then the electrical function is improved, but heat generation increases and cooling efficiency decreases
Why choose this principle:
The patent introduces intermediary thermal conduction structures including thermal conduction members between the capacitor and capacitor cooling plate, and thermal conduction paste in the grooves. These intermediaries improve the thermal coupling between heat-generating components and cooling structures, enabling more effective heat transfer without compromising electrical connections.
Application Domain
Data Source
AI summary:
The semiconductor module incorporates a cooling device with a refrigerant circulation system and strategically arranged metal bodies and circuit substrates to efficiently transfer heat from semiconductor chips and capacitors to cooling fins, enhancing thermal management.
Abstract
A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device has: an input terminal; a wiring portion that includes a first end portion, and a second end portion, and extends in one direction, the first end portion being connected to the input terminal; a circuit substrate that includes a top surface, and a bottom surface, the top surface being provided with a first circuit board and a second circuit board along the one direction, the bottom surface being arranged on a top surface of the cooling device; a metal body connected between the wiring portion, and a top surface of the first circuit board; and a semiconductor chip that includes a top surface electrode, and a bottom surface electrode, the top surface electrode being connected to the second end portion, the bottom surface electrode being connected to a top surface of the second circuit board.