Preventing Sink Marks in Light Emitting Device Manufacturing
Here’s PatSnap Eureka !
Summary
Problems
The existing methods for manufacturing light emitting devices using LEDs face challenges in forming a stable resin member, particularly due to the generation of 'sink marks' during the curing process, which affects the uniformity and stability of the reflective resin layer, especially when protective elements are not adequately arranged between light emitting elements.
Innovation solutions
A method involving the use of first and second protruding members on a collective substrate, where the second protruding member is harder than the cover member, to prevent resin shrinkage and ensure a stable shape during the singulation process, thereby maintaining the height and stability of the resin member.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If protective elements are arranged between light emitting elements to prevent sink marks, then the stability of resin member shape is improved, but device complexity increases
Why choose this principle:
The patent uses protruding members made of inexpensive materials (such as resin or metal) that are arranged on the collective substrate to prevent sink marks. These protruding members serve as temporary support structures during the curing process and are later removed during singulation, eliminating the need for complex protective element arrangements while maintaining resin shape stability.
Principle concept:
If protective elements are arranged between light emitting elements to prevent sink marks, then the stability of resin member shape is improved, but device complexity increases
Why choose this principle:
The patent changes the physical parameters of the mold by incorporating protruding members with specific heights and positions. These protruding members create physical constraints that prevent resin shrinkage and sink mark formation during curing. The parameters of the protruding members (height, position, material) are optimized to prevent sink marks without requiring complex protective element structures.
Application Domain
Data Source
AI summary:
A method involving the use of first and second protruding members on a collective substrate, where the second protruding member is harder than the cover member, to prevent resin shrinkage and ensure a stable shape during the singulation process, thereby maintaining the height and stability of the resin member.
Abstract
A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.